loadpatents
name:-0.0051290988922119
name:-0.0061860084533691
name:-0.0016369819641113
Jaervinen; Pauli Patent Filings

Jaervinen; Pauli

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jaervinen; Pauli.The latest application filed is for "integrated circuit package having wirebonded multi-die stack".

Company Profile
1.6.6
  • Jaervinen; Pauli - Wallerfing DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Antenna on ceramics for a packaged die
Grant 10,319,688 - Wolter , et al.
2019-06-11
Integrated circuit package having wirebonded multi-die stack
Grant 10,249,598 - Meyer , et al.
2019-04-02
Integrated Circuit Package Having Wirebonded Multi-die Stack
App 20180315737 - Meyer; Thorsten ;   et al.
2018-11-01
Integrated Circuit Package Having Wirebonded Multi-die Stack
App 20180197840 - Meyer; Thorsten ;   et al.
2018-07-12
Integrated circuit package having wirebonded multi-die stack
Grant 9,972,601 - Meyer , et al. May 15, 2
2018-05-15
Bulk acoustic wave resonator tuner circuits
Grant 9,819,327 - Maruthamuthu , et al. November 14, 2
2017-11-14
Integrated Circuit Package Having Wirebonded Multi-die Stack
App 20160276311 - Meyer; Thorsten ;   et al.
2016-09-22
Antenna On Ceramics For A Packaged Die
App 20160240492 - Wolter; Andreas ;   et al.
2016-08-18
Bulk Acoustic Wave Resonator Tuner Circuits
App 20150333401 - Maruthamuthu; Saravana ;   et al.
2015-11-19
Semiconductor device with capacitive coupling structure
Grant 8,779,564 - Knudsen , et al. July 15, 2
2014-07-15

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