Jadhav; Susheel G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jadhav; Susheel G..The latest application filed is for "decoupling layer to reduce underfill stress in semiconductor devices".

Company Profile

1.9.10

Jadhav; Susheel G. - Los Gatos CA
Jadhav; Susheel G. - Chandler AZ
Jadhav; Susheel G - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Decoupling Layer To Reduce Underfill Stress In Semiconductor Devices App 20210066882 - Dobriyal; Priyanka ; et al.	2021-03-04
Hybrid Interconnect For Low Temperature Attach App 20160260679 - Mirpuri; Kabirkumar J. ; et al.	2016-09-08
Solder deposition and thermal processing of thin-die thermal interface material Grant 8,733,620 - Renavikar , et al. May 27, 2	2014-05-27
Coated thermal interface in integrated circuit die Grant 7,955,900 - Jadhav , et al. June 7, 2	2011-06-07
Integrating a heat spreader with an interface material having reduced void size Grant 7,553,702 - Fitzgerald , et al. June 30, 2	2009-06-30
Integrated heat spreader with intermetallic layer and method for making Grant 7,485,495 - Renavikar , et al. February 3, 2	2009-02-03
Coated Thermal Interface In Integrated Circuit Die App 20070231967 - Jadhav; Susheel G. ; et al.	2007-10-04
Integrated Heat Spreader And Method For Using App 20070206356 - Fitzgerald; Thomas J. ; et al.	2007-09-06
Integrated heat spreader and method for using Grant 7,239,517 - Fitzgerald , et al. July 3, 2	2007-07-03
Solder deposition and thermal processing of thin-die thermal interface material App 20070131737 - Renavikar; Mukul ; et al.	2007-06-14
Integrated Heat Spreader With Intermetallic Layer And Method For Making App 20070117270 - Renavikar; Mukul P. ; et al.	2007-05-24
Method for attaching a semiconductor die to a substrate and heat spreader Grant 7,220,622 - Jadhav , et al. May 22, 2	2007-05-22
Integrated heat spreader with intermetallic layer and method for making Grant 7,183,641 - Renavikar , et al. February 27, 2	2007-02-27
Thermal interface apparatus, systems, and methods Grant 7,164,585 - Jadhav , et al. January 16, 2	2007-01-16
Integrated heat spreader and method for using App 20060227510 - Fitzgerald; Thomas J. ; et al.	2006-10-12
Integrated heat spreader with intermetallic layer and method for making App 20060220226 - Renavikar; Mukul P. ; et al.	2006-10-05
Method for attaching a semiconductor die to a substrate and heat spreader App 20060063310 - Jadhav; Susheel G. ; et al.	2006-03-23
Thermal interface apparatus, systems, and methods App 20040190263 - Jadhav, Susheel G. ; et al.	2004-09-30

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