Jacquet; Fabrice

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jacquet; Fabrice.The latest application filed is for "method of encapsulation of a microcomponent".

Company Profile

0.15.9

Jacquet; Fabrice - Saint Pierre de Mesage N/A FR
Jacquet; Fabrice - St Pierre de Mesage FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for metalizing blind vias Grant 9,003,654 - Jacquet , et al. April 14, 2	2015-04-14
Method of encapsulation of a microcomponent Grant 8,906,750 - Jacquet , et al. December 9, 2	2014-12-09
Sealed cavity and method for producing such a sealed cavity Grant 8,772,883 - Pornin , et al. July 8, 2	2014-07-08
Interconnect structure with cavity having one or several contact rises on the wall of the cavity and method for producing same Grant 8,674,489 - Bolis , et al. March 18, 2	2014-03-18
Method Of Encapsulation Of A Microcomponent App 20130288429 - Jacquet; Fabrice ; et al.	2013-10-31
Method for producing a device with a fluid-encapsulating membrane Grant 8,551,352 - Pouydebasque , et al. October 8, 2	2013-10-08
Interconnect structure comprising blind vias intended to be metalized Grant 8,482,130 - Saint-Patrice , et al. July 9, 2	2013-07-09
Method for making a cavity in the thickness of a substrate which may form a site for receiving a component Grant 8,470,184 - Saint-Patrice , et al. June 25, 2	2013-06-25
Microcomponent provided with a cavity delimited by a cap with enhanced mechanical resistance Grant 8,183,474 - Gillot , et al. May 22, 2	2012-05-22
Sealed Cavity And Method For Producing Such A Sealed Cavity App 20120112293 - Pornin; Jean-Louis ; et al.	2012-05-10
Method For Making A Cavity In The Thickness Of A Substrate Which May Form A Site For Receiving A Component App 20120031874 - Saint-Patrice; Damien ; et al.	2012-02-09
Method For Producing A Device With A Fluid-encapsulating Membrane App 20120006783 - Pouydebasque; Arnaud ; et al.	2012-01-12
Method For Metalizing Blind Vias App 20110219612 - JACQUET; Fabrice ; et al.	2011-09-15
Interconnect Structure Comprising Blind Vias Intended To Be Metalized App 20110221068 - SAINT-PATRICE; Damien ; et al.	2011-09-15
Interconnect Structure With Cavity Having One Or Several Contact Rises On The Wall Of The Cavity And Method For Producing Same App 20110097909 - BOLIS; Sebastien ; et al.	2011-04-28
Microcomponent Provided with a Cavity Delimited by a Cap with Enhanced Mechanical Resistance App 20090194309 - Gillot; Charlotte ; et al.	2009-08-06

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