Jacobson; John O.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jacobson; John O..The latest application filed is for "method for using data regarding manufacturing procedures integrated circuits (ics) have undergone, such as repairs, to select procedures the ics will undergo, such as additional repairs".

Company Profile

0.41.20

Jacobson; John O. - Boise ID
Jacobson; John O - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor devices with permanent polymer stencil and method for manufacturing the same Grant 7,589,010 - Farnworth , et al. September 15, 2	2009-09-15
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs Grant 7,561,938 - Akram , et al. July 14, 2	2009-07-14
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs App 20070088451 - Akram; Salman ; et al.	2007-04-19
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs Grant 7,155,300 - Akram , et al. December 26, 2	2006-12-26
Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs Grant 7,120,513 - Akram , et al. October 10, 2	2006-10-10
Method of temporarily securing a die to a burn-in carrier Grant 7,105,380 - Moden , et al. September 12, 2	2006-09-12
Semiconductor devices with permanent polymer stencil and method for manufacturing the same Grant 6,998,334 - Farnworth , et al. February 14, 2	2006-02-14
Semiconductor devices with permanent polymer stencil and method for manufacturing the same App 20060003569 - Farnworth; Warren M. ; et al.	2006-01-05
Method of temporarily securing a die to a burn-in carrier App 20050272172 - Moden, Walter L. ; et al.	2005-12-08
Apparatus for automatically positioning electronic dice within component packages Grant 6,900,459 - Farnworth , et al. May 31, 2	2005-05-31
Burn-in carrier for a semiconductor die Grant 6,894,521 - Moden , et al. May 17, 2	2005-05-17
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems Grant 6,851,597 - Hembree , et al. February 8, 2	2005-02-08
Semiconductor substract with substantially matched lines Grant 6,713,879 - Akram , et al. March 30, 2	2004-03-30
Methods for fabricating flip-chip devices and preventing coupling between signal interconnections Grant 6,703,714 - Akram , et al. March 9, 2	2004-03-09
Method for fabricating interconnect having support members for preventing component flexure Grant 6,687,989 - Farnworth , et al. February 10, 2	2004-02-10
Semiconductor devices with permanent polymer stencil and method for manufacturing the same App 20040005770 - Farnworth, Warren M. ; et al.	2004-01-08
Method of temporarily securing a die to a burn-in carrier App 20030206034 - Moden, Walter L. ; et al.	2003-11-06
Test carrier with molded interconnect for testing semiconductor components Grant 6,642,730 - Hembree , et al. November 4, 2	2003-11-04
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's undergo, such as additional repairs App 20030191550 - Akram, Salman ; et al.	2003-10-09
Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps Grant 6,627,999 - Akram , et al. September 30, 2	2003-09-30
Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems Grant 6,619,532 - Hembree , et al. September 16, 2	2003-09-16
Method of temporarily securing a die to a burn-in carrier App 20030138980 - Moden, Walter L. ; et al.	2003-07-24
Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps App 20030094631 - Akram, Salman ; et al.	2003-05-22
Method and apparatus for automatically positioning electronic dice within component packages App 20030088973 - Farnworth, Warren M. ; et al.	2003-05-15
Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs Grant 6,553,276 - Akram , et al. April 22, 2	2003-04-22
Test carrier with molded interconnect for testing semiconductor components Grant 6,544,461 - Hembree , et al. April 8, 2	2003-04-08
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems App 20030057260 - Hembree, David R. ; et al.	2003-03-27
Method for automatically positioning electronic die within component packages Grant 6,492,187 - Farnworth , et al. December 10, 2	2002-12-10
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems App 20020179681 - Hembree, David R. ; et al.	2002-12-05
Flip-chip with matched lines and ground plane App 20020175422 - Akram, Salman ; et al.	2002-11-28
Flip-chip with matched lines and ground plane Grant 6,462,423 - Akram , et al. October 8, 2	2002-10-08
Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumps App 20020113320 - Akram, Salman ; et al.	2002-08-22
Calibration target for calibrating semiconductor wafer test systems Grant 6,420,892 - Krivy , et al. July 16, 2	2002-07-16
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs App 20020082740 - Akram, Salman ; et al.	2002-06-27
Burn-in carrier and semiconductor die assembly App 20020079919 - Moden, Walter L. ; et al.	2002-06-27
Test carrier for testing semiconductor components including interconnect with support members for preventing component flexure Grant 6,369,600 - Farnworth , et al. April 9, 2	2002-04-09
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs Grant 6,363,295 - Akram , et al. March 26, 2	2002-03-26
Method for positioning a semiconductor die within a temporary package Grant 6,353,312 - Farnworth , et al. March 5, 2	2002-03-05
Test Carrier For Testing Semiconductor Components Including Interconnect With Support Members For Preventing Component Flexure App 20010052785 - FARNWORTH, WARREN M. ; et al.	2001-12-20
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems App 20010048018 - Hembree, David R. ; et al.	2001-12-06
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems App 20010045446 - Hembree, David R. ; et al.	2001-11-29
Test Carrier With Molded Interconnect For Testing Semiconductor Components App 20010043074 - HEMBREE, DAVID R. ; et al.	2001-11-22
Method For Testing Semiconductor Wafers App 20010011899 - FARNWORTH, WARREN M. ; et al.	2001-08-09
Wire bond monitoring system for layered packages Grant 6,247,629 - Jacobson , et al. June 19, 2	2001-06-19
Calibration target for calibrating semiconductor wafer test systems Grant 6,239,590 - Krivy , et al. May 29, 2	2001-05-29
Method for testing semiconductor components Grant 6,208,157 - Akram , et al. March 27, 2	2001-03-27
System for testing semiconductor components Grant 6,072,326 - Akram , et al. June 6, 2	2000-06-06
Apparatus for testing semiconductor wafers Grant 6,064,216 - Farnworth , et al. May 16, 2	2000-05-16
Method and apparatus for automatically positioning electronic dice within component packages Grant 6,064,194 - Farnworth , et al. May 16, 2	2000-05-16
Semiconductor package with pre-fabricated cover Grant 6,057,597 - Farnworth , et al. May 2, 2	2000-05-02
Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systems Grant 6,045,026 - Hembree , et al. April 4, 2	2000-04-04
Method and apparatus for automatically positioning electronic dice within component packages Grant 5,955,877 - Farnworth , et al. September 21, 1	1999-09-21
Apparatus for testing semiconductor wafers Grant 5,952,840 - Farnworth , et al. September 14, 1	1999-09-14
Interconnect for making temporary electrical connections with bumped semiconductor components Grant 5,931,685 - Hembree , et al. August 3, 1	1999-08-03
Partial replacement of partially defective memory devices Grant 5,920,513 - Jacobson July 6, 1	1999-07-06
System and interconnect for making temporary electrical connections with bumped semiconductor components Grant 5,915,977 - Hembree , et al. June 29, 1	1999-06-29
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs Grant 5,907,492 - Akram , et al. May 25, 1	1999-05-25
Encapsulant dam standoff for shell-enclosed die assemblies Grant 5,895,222 - Moden , et al. April 20, 1	1999-04-20
Semiconductor package with pre-fabricated cover and method of fabrication Grant 5,893,726 - Farnworth , et al. April 13, 1	1999-04-13
Method and apparatus for automatically positioning electronic dice within component packages Grant 5,894,218 - Farnworth , et al. April 13, 1	1999-04-13
Method for packaging semiconductor dice Grant 5,593,927 - Farnworth , et al. January 14, 1	1997-01-14

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