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name:-0.011270999908447
name:-0.0079929828643799
name:-0.0029120445251465
Jacobsen; Stuart Patent Filings

Jacobsen; Stuart

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jacobsen; Stuart.The latest application filed is for "structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip".

Company Profile
2.9.10
  • Jacobsen; Stuart - Frisco TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip
App 20200354214 - Wachtler; Kurt Peter ;   et al.
2020-11-12
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
Grant 10,723,616 - Wachtler , et al.
2020-07-28
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip
App 20190169019 - Wachtler; Kurt Peter ;   et al.
2019-06-06
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
Grant 10,233,074 - Wachtler , et al.
2019-03-19
Structures For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip
App 20180127266 - Wachtler; Kurt Peter ;   et al.
2018-05-10
Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip
Grant 9,896,330 - Wachtler , et al. February 20, 2
2018-02-20
Structure And Method For Packaging Stress-sensitive Micro-electro-mechanical System Stacked Onto Electronic Circuit Chip
App 20170197823 - Wachtler; Kurt Peter ;   et al.
2017-07-13
Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters
Grant 8,968,527 - Guan , et al. March 3, 2
2015-03-03
Process for reactive ion etching a layer of diamond like carbon
Grant 8,409,458 - Shoemaker , et al. April 2, 2
2013-04-02
Micro-Fluid Ejection Devices, Methods for Making Micro-Fluid Ejection Heads, And Micro-Fluid Ejection Head Having High Resistance Thin Film Heaters
App 20110094102 - Guan; Yimin ;   et al.
2011-04-28
Semiconductor device including an amorphous nitrided silicon adhesion layer and method of manufacture therefor
Grant 7,795,070 - Wang , et al. September 14, 2
2010-09-14
Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters
Grant 7,673,972 - Guan , et al. March 9, 2
2010-03-09
Semiconductor Device Including An Amorphous Nitrided Silicon Adhesion Layer And Method Of Manufacture Therefor
App 20080237865 - Wang; Maria ;   et al.
2008-10-02
Method For Manufacturing An Improved Resistive Structure
App 20080213927 - Wang; Maria ;   et al.
2008-09-04
Method For Removing Diamond Like Carbon Residue From A Deposition/etch Chamber Using A Plasma Clean
App 20080214007 - Wang; Maria ;   et al.
2008-09-04
Process For Reactive Ion Etching A Layer Of Diamond Like Carbon
App 20080214016 - Shoemaker; Erika Leigh ;   et al.
2008-09-04
Micro-Fluid Ejection Devices, Methods For Making Micro-Fluid Ejection Heads, and Micro-Fluid Ejection Head Having High Resistance Thin Film Heaters
App 20080165227 - Guan; Yimin ;   et al.
2008-07-10

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