Jackson, Timothy L

USPTO Trademark & Patent Filings

Jackson Timothy L

Trademark applications and grants for Jackson, Timothy L. Jackson, Timothy L has 3 trademark applications. The latest application filed is for "GOLDROOM SESSIONS"

Company Profile
    Company Aliases
  • Jackson, Timothy L
  • Jackson, Timothy L.
  • l timothy jackson
  • Jackson; Timothy L. - Eagle ID
  • Jackson, Timothy L. - Eagle ID
Entity Type INDIVIDUAL
Address 12202 Oyster Cove Ct. Stafford, TEXAS UNITED STATES 77477

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks Patents
Patent Applications
Patent ApplicationDate
SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS
20080153204 - 11/968359 Jackson; Timothy L. ;   et al.
2008-06-26
THIN FLIP-CHIP METHOD
20080048343 - 11/923832 Grigg; Ford B. ;   et al.
2008-02-28
Stacked die module and techniques for forming a stacked die module
20060063283 - 11/266972 Cobbley; Chad A. ;   et al.
2006-03-23
Thin flip-chip method
20050208734 - 11/142578 Grigg, Ford B. ;   et al.
2005-09-22
Semiconductor dice having backside redistribution layer accessed using through-silicon vias, methods
20050186705 - 11/110431 Jackson, Timothy L. ;   et al.
2005-08-25
Thin flip-chip method
7,811,903 - 11/923,832 Grigg , et al. October 12, 2
2010-10-12
Stacked die module including multiple adhesives that cure at different temperatures
7,755,204 - 10/672,750 Cobbley , et al. July 13, 2
2010-07-13
Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
7,355,273 - 11/110,431 Jackson , et al. April 8, 2
2008-04-08
Thin flip-chip method
7,291,543 - 11/142,578 Grigg , et al. November 6, 2
2007-11-06
Stacked die module and techniques for forming a stacked die module
7,217,596 - 10/770,941 Cobbley , et al. May 15, 2
2007-05-15
Patent Grants & Applications

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