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Patent applications and USPTO patent grants for Jackson; John A..The latest application filed is for "chip-on-chip integrated circuit package and method for making the same".
Patent | Date |
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Chip-on-chip integrated circuit package and method for making the same Grant 6,084,308 - Kelkar , et al. July 4, 2 | 2000-07-04 |
Apparatus and method for inspecting and testing industrial power saws or the like Grant 4,809,200 - Moore , et al. February 28, 1 | 1989-02-28 |
Liquid level sensor and electrode assembly therefor Grant 3,939,360 - Jackson February 17, 1 | 1976-02-17 |
Encapsulated solid state electronic devices having a sealed lead-encapsulant interface Grant 3,911,475 - Szedon , et al. October 7, 1 | 1975-10-07 |
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