Jackson; James Daniel

Patent Applications and Registrations

Patent applications and USPTO patent grants for Jackson; James Daniel.The latest application filed is for "surface mount solder method and apparatus for decoupling capacitance and process of making".

Company Profile

0.4.4

Jackson; James Daniel - Beaverton OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Surface mount solder method and apparatus for decoupling capacitance and process of making Grant 7,135,758 - Searls , et al. November 14, 2	2006-11-14
Method and apparatus using nanotubes for cooling and grounding die Grant 6,856,016 - Searls , et al. February 15, 2	2005-02-15
Surface mount solder method and apparatus for decoupling capacitance and process of making App 20040155335 - Searls, Damion T. ; et al.	2004-08-12
Surface mount solder method and apparatus for decoupling capacitance and process of making Grant 6,713,871 - Searls , et al. March 30, 2	2004-03-30
Method And Apparatus Using Nanotubes For Cooling And Grounding Die App 20040005736 - Searls, Damion T. ; et al.	2004-01-08
Surface mount solder method and apparatus for decoupling capacitance and process of making App 20030218235 - Searls, Damion T. ; et al.	2003-11-27
Electronic assembly with separate power and signal connections Grant 6,627,822 - Jackson , et al. September 30, 2	2003-09-30
Electronic assembly with separate power and signal connections App 20030001254 - Jackson, James Daniel ; et al.	2003-01-02

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