IZUNOME; Koji

Patent Applications and Registrations

Patent applications and USPTO patent grants for IZUNOME; Koji.The latest application filed is for "method for producing three-dimensional structure, method for producing vertical transistor, vertical transistor wafer, and vertical transistor substrate".

Company Profile

1.16.19

IZUNOME; Koji - Kitakanbara-gun JP
Izunome; Koji - Niigata N/A JP
Izunome; Koji - Shibata JP
Izunome; Koji - Shibata-shi JP
Izunome; Koji - Niigata-ken JP
Izunome; Koji - Ami-machi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Producing Three-dimensional Structure, Method For Producing Vertical Transistor, Vertical Transistor Wafer, And Vertical Transistor Substrate App 20220093396 - KAMIJO; Kazutaka ; et al.	2022-03-24
Method For Producing Three-dimensional Structure, Method For Producing Vertical Transistor, Vertical Transistor Wafer, And Verti App 20200211840 - KAMIJO; Kazutaka ; et al.	2020-07-02
Silicon wafer and method for heat-treating silicon wafer Grant 8,999,864 - Senda , et al. April 7, 2	2015-04-07
Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling process Grant 8,476,149 - Isogai , et al. July 2, 2	2013-07-02
Method for heat treating a silicon wafer Grant 8,399,341 - Senda , et al. March 19, 2	2013-03-19
Method of heat treating silicon wafer Grant 8,252,700 - Senda , et al. August 28, 2	2012-08-28
Method For Heat Treating A Silicon Wafer App 20120184091 - Senda; Takeshi ; et al.	2012-07-19
Silicon Wafer And Method For Heat-treating Silicon Wafer App 20120139088 - Senda; Takeshi ; et al.	2012-06-07
Manufacturing method for silicon wafer Grant 7,977,219 - Isogai , et al. July 12, 2	2011-07-12
Method of heat treating silicon wafer App 20100197146 - Senda; Takeshi ; et al.	2010-08-05
Surface inspection apparatus and surface inspection method for strained silicon wafer Grant 7,679,730 - Takano , et al. March 16, 2	2010-03-16
Manufacturing Method For Silicon Wafer App 20100055884 - Isogai; Hiromichi ; et al.	2010-03-04
Silicon Wafer, Method For Manufacturing The Same And Method For Heat-treating The Same App 20100038757 - Isogai; Hiromichi ; et al.	2010-02-18
Surface Inspection Apparatus And Surface Inspection Method For Strained Silicon Wafer App 20090066933 - Takano; Hideaki ; et al.	2009-03-12
Method Of Manufacturing Semiconductor Substrate App 20090004825 - SENDA; Takeshi ; et al.	2009-01-01
Surface inspection apparatus and surface inspection method Grant 7,403,278 - Hayashi , et al. July 22, 2	2008-07-22
Semiconductor Substrate And Manufacturing Method Thereof App 20080164572 - Toyoda; Eiji ; et al.	2008-07-10
Heat Treatment Method For Silicon Wafer App 20080166891 - Hirasawa; Manabu ; et al.	2008-07-10
Silicon Wafer App 20070240628 - Watanabe; Takashi ; et al.	2007-10-18
Surface Inspection Apparatus And Surface Inspection Method App 20070222977 - Hayashi; Yoshinori ; et al.	2007-09-27
Manufacturing method for strained silicon wafer Grant 7,250,357 - Senda , et al. July 31, 2	2007-07-31
Manufacturing method for strained silicon wafer Grant 7,247,583 - Kurita , et al. July 24, 2	2007-07-24
Method of manufacturing silicon wafer App 20070068447 - Izunome; Koji ; et al.	2007-03-29
Semiconductor substrate comprising a support substrate which comprises a gettering site Grant 7,193,294 - Yoshimura , et al. March 20, 2	2007-03-20
Wafer inspection apparatus Grant 7,149,341 - Hayashi , et al. December 12, 2	2006-12-12
Manufacturing method for a silicon substrate having strained layer Grant 7,060,597 - Kurita , et al. June 13, 2	2006-06-13
A semiconductor substrate comprising a support substrate which comprises a gettering site App 20060118868 - Yoshimura; Reiko ; et al.	2006-06-08
Manufacturing method for strained silicon wafer App 20060057856 - Senda; Takeshi ; et al.	2006-03-16
Manufacturing method for strained silicon wafer App 20050170664 - Kurita, Hisatsugu ; et al.	2005-08-04
Manufacturing method for a silicon substrate having strained layer App 20040235274 - Kurita, Hisatsugu ; et al.	2004-11-25
Wafer inspection apparatus App 20030169916 - Hayashi, Yoshinori ; et al.	2003-09-11
Growth of silicon crystal from melt having extraordinary eddy flows on its surface Grant 5,704,974 - Izunome , et al. January 6, 1	1998-01-06

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