Izumi; Shigeto

Patent Applications and Registrations

Patent applications and USPTO patent grants for Izumi; Shigeto.The latest application filed is for "pressing apparatus, substrate bonding apparatus and stacked substrate".

Company Profile

0.9.7

Izumi; Shigeto - Yokohama JP
Izumi; Shigeto - Yokohama-shi JP
Izumi; Shigeto - Kanagawa-ken JP
Izumi; Shigeto - Ayase JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pressing apparatus, substrate bonding apparatus and stacked substrate Grant 9,978,616 - Izumi , et al. May 22, 2	2018-05-22
Pressuring module, pressuring apparatus, substrate bonding apparatus, substrate bonding method, and bonded substrate Grant 9,498,944 - Izumi November 22, 2	2016-11-22
Pressing Apparatus, Substrate Bonding Apparatus And Stacked Substrate App 20140349118 - Izumi; Shigeto ; et al.	2014-11-27
Pressuring Module, Pressuring Apparatus, Substrate Bonding Apparatus, Substrate Bonding Method, and Bonded Substrate App 20140262045 - Tanaka; Keiichi ; et al.	2014-09-18
Wafer bonding apparatus Grant 8,794,287 - Izumi August 5, 2	2014-08-05
Pressuring Module, Pressuring Apparatus, Substrate Bonding Apparatus, Substrate Bonding Method, And Bonded Substrate App 20120251789 - TANAKA; Keiichi ; et al.	2012-10-04
Water Bonding Apparatus App 20120234454 - IZUMI; Shigeto	2012-09-20
Wafer bonding apparatus Grant 8,206,525 - Izumi June 26, 2	2012-06-26
Wafer Bonding Apparatus App 20090317960 - Izumi; Shigeto	2009-12-24
Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus Grant 7,175,504 - Izumi , et al. February 13, 2	2007-02-13
Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method Grant 7,175,508 - Izumi February 13, 2	2007-02-13
Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method App 20060148384 - Izumi; Shigeto	2006-07-06
Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus App 20060052037 - Izumi; Shigeto ; et al.	2006-03-09
Carriers and polishing apparatus Grant 6,273,803 - Wang , et al. August 14, 2	2001-08-14
Carrier and CMP apparatus Grant 6,012,964 - Arai , et al. January 11, 2	2000-01-11

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