Izumi; Atsuhiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Izumi; Atsuhiko.The latest application filed is for "molding die for sealing semiconductor device with reduced resin burrs".
- Izumi; Atsuhiko - Tokyo JP
- Izumi; Atsuhiko - Yokohama JP
| Patent | Date |
|---|---|
| Molding die for sealing semiconductor device with reduced resin burrs Grant 5,635,220 - Izumi , et al. June 3, 1 | 1997-06-03 |
| Leadframe for semiconductor devices Grant 5,623,163 - Izumi April 22, 1 | 1997-04-22 |
| Gas turbine combustor with nozzle pressure ratio control Grant 5,311,742 - Izumi , et al. May 17, 1 | 1994-05-17 |
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