Izawa; Seiji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Izawa; Seiji.The latest application filed is for "electronic component built-in wiring board and method for manufacturing the same".
- Izawa; Seiji - Ogaki JP
- Izawa; Seiji - Ibi-gun N/A JP
| Patent | Date |
|---|---|
| Electronic component built-in wiring board and method for manufacturing the same Grant 11,437,290 - Tanaka , et al. September 6, 2 | 2022-09-06 |
| Electronic Component Built-in Wiring Board And Method For Manufacturing The Same App 20220254693 - TANAKA; Yusuke ; et al. | 2022-08-11 |
| Component Built-in Wiring Substrate App 20220087024 - YAMADA; Takahiro ; et al. | 2022-03-17 |
| Electronic Component Built-in Wiring Board And Method For Manufacturing The Same App 20200357712 - TANAKA; Yusuke ; et al. | 2020-11-12 |
| Method of manufacturing a multilayered printed wiring board Grant 8,966,750 - Ikeda , et al. March 3, 2 | 2015-03-03 |
| Multilayered printed wiring board with a multilayered core substrate Grant 8,242,379 - Ikeda , et al. August 14, 2 | 2012-08-14 |
| Multilayered Printed Wiring Board App 20110247208 - IKEDA; Tomoyuki ; et al. | 2011-10-13 |
| Multilayered Printed Wiring Board App 20080107863 - Ikeda; Tomoyuki ; et al. | 2008-05-08 |
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