Iyer; Shridhar R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iyer; Shridhar R..The latest application filed is for "die attach adhesive compositions".
- Iyer; Shridhar R. - Sugar Land TX
| Patent | Date |
|---|---|
| Die attach adhesive compositions Grant 5,973,052 - Iyer , et al. October 26, 1 | 1999-10-26 |
| Die attach adhesive compositions Grant 5,912,282 - Iyer , et al. June 15, 1 | 1999-06-15 |
| Anisotropic conductive adhesive compositions Grant 5,840,215 - Iyer , et al. November 24, 1 | 1998-11-24 |
| Thermally reworkable binders for flip-chip devices Grant 5,760,337 - Iyer , et al. June 2, 1 | 1998-06-02 |
| Thermosetting Encapsulants for electronics packaging Grant 5,726,391 - Iyer , et al. March 10, 1 | 1998-03-10 |
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