Iyer; Aparna

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iyer; Aparna.The latest application filed is for "transfer arm for film frame substrate handling during plasma singulation of wafers".

Company Profile

1.24.38

Iyer; Aparna - Sunnyvale CA
Iyer; Aparna - Storrs CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Proximity contact cover ring for plasma dicing Grant 11,195,756 - Holden , et al. December 7, 2	2021-12-07
Transfer Arm For Film Frame Substrate Handling During Plasma Singulation Of Wafers App 20200258780 - A1	2020-08-13
Transfer arm for film frame substrate handling during plasma singulation of wafers Grant 10,692,765 - Holden , et al.	2020-06-23
Dicing wafers having solder bumps on wafer backside Grant 9,343,366 - Lei , et al. May 17, 2	2016-05-17
Transfer Arm For Film Frame Substrate Handling During Plasma Singulation Of Wafers App 20160133519 - Holden; James M. ; et al.	2016-05-12
Method and carrier for dicing a wafer Grant 9,299,614 - Holden , et al. March 29, 2	2016-03-29
Proximity Contact Cover Ring For Plasma Dicing App 20160086852 - Holden; James M. ; et al.	2016-03-24
Dicing processes for thin wafers with bumps on wafer backside Grant 9,275,902 - Lei , et al. March 1, 2	2016-03-01
Wafer dicing with etch chamber shield ring for film frame wafer applications Grant 9,236,305 - Lei , et al. January 12, 2	2016-01-12
Method of coating water soluble mask for laser scribing and plasma etch Grant 9,177,864 - Lei , et al. November 3, 2	2015-11-03
Dicing Wafers Having Solder Bumps On Wafer Backside App 20150303111 - Lei; Wei-Sheng ; et al.	2015-10-22
Dicing Processes For Thin Wafers With Bumps On Wafer Backside App 20150279739 - Lei; Wei-Sheng ; et al.	2015-10-01
Wafer dicing method for improving die packaging quality Grant 9,105,710 - Lei , et al. August 11, 2	2015-08-11
Method And Carrier For Dicing A Wafer App 20150162244 - Holden; James M. ; et al.	2015-06-11
Method Of Diced Wafer Transportation App 20150102467 - Lei; Wei-Sheng ; et al.	2015-04-16
Pre-patterned dry laminate mask for wafer dicing processes Grant 8,999,816 - Holden , et al. April 7, 2	2015-04-07
Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers Grant 8,980,726 - Lei , et al. March 17, 2	2015-03-17
Wafer dicing from wafer backside Grant 8,975,162 - Lei , et al. March 10, 2	2015-03-10
Wafer Dicing Method For Improving Die Packaging Quality App 20150064878 - LEI; Wei-Sheng ; et al.	2015-03-05
Wafer dicing using hybrid split-beam laser scribing process with plasma etch Grant 8,951,819 - Lei , et al. February 10, 2	2015-02-10
Wafer Dicing With Wide Kerf By Laser Scribing And Plasma Etching Hybrid Approach App 20150028446 - Lei; Wei-Sheng ; et al.	2015-01-29
Method of diced wafer transportation Grant 8,940,619 - Lei , et al. January 27, 2	2015-01-27
Laser Scribing And Plasma Etch For High Die Break Strength And Smooth Sidewall App 20150011073 - Lei; Wei-Sheng ; et al.	2015-01-08
Method Of Coating Water Soluble Mask For Laser Scribing And Plasma Etch App 20140377937 - Lei; Wei-Sheng ; et al.	2014-12-25
Dicing wafers having solder bumps on wafer backside Grant 8,912,078 - Lei , et al. December 16, 2	2014-12-16
Wafer Dicing With Wide Kerf By Laser Scribing And Plasma Etching Hybrid Approach App 20140346641 - Lei; Wei-Sheng ; et al.	2014-11-27
Method of synthesizing multi-phase oxide ceramics with small phase domain sizes Grant 8,877,119 - Jordan , et al. November 4, 2	2014-11-04
Method of coating water soluble mask for laser scribing and plasma etch Grant 8,859,397 - Lei , et al. October 14, 2	2014-10-14
Substrate Laser Dicing Mask Including Laser Energy Absorbing Water-soluble Film App 20140273401 - LEI; Wei-Sheng ; et al.	2014-09-18
Substrate Dicing By Laser Ablation & Plasma Etch Damage Removal For Ultra-thin Wafers App 20140213042 - LEI; Wei-Sheng ; et al.	2014-07-31
Laser And Plasma Etch Wafer Dicing With Etch Chamber Shield Ring For Film Frame Wafer Applications App 20140213041 - LEI; Wei-Sheng ; et al.	2014-07-31
Wafer Dicing From Wafer Backside App 20140179084 - Lei; Wei-Sheng ; et al.	2014-06-26
Mask Residue Removal For Substrate Dicing By Laser And Plasma Etch App 20140057414 - IYER; Aparna ; et al.	2014-02-27
Method Of Diced Wafer Transportation App 20140015109 - Lei; Wei-Sheng ; et al.	2014-01-16
Method Of Coating Water Soluble Mask For Laser Scribing And Plasma Etch App 20140017882 - Lei; Wei-Sheng ; et al.	2014-01-16
Wafer Dicing Using Hybrid Split-beam Laser Scribing Process With Plasma Etch App 20130017668 - Lei; Wei-Sheng ; et al.	2013-01-17
Method Of Synthesizing Multi-iphase Oxide Ceramics With Small Phase Domain Sizes App 20120322645 - Jordan; Eric H. ; et al.	2012-12-20

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