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Patent applications and USPTO patent grants for Iwayama; Gento.The latest application filed is for "dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate".
Patent | Date |
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Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate Grant 9,596,754 - Iwayama , et al. March 14, 2 | 2017-03-14 |
Photosensitive Composition, Hardened Coating Films Therefrom, And Printed Wiring Boards Using Same App 20150014029 - Iwayama; Gento ;   et al. | 2015-01-15 |
Dry Film, Printed Wiring Board Using Same, Method For Producing Printed Wiring Board, And Flip Chip Mounting Substrate App 20150016072 - Iwayama; Gento ;   et al. | 2015-01-15 |
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