IWAYA; Akihiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for IWAYA; Akihiko.The latest application filed is for "semiconductor module and method for manufacturing semiconductor module".
- IWAYA; Akihiko - Suginami-ku JP
- Iwaya; Akihiko - Tokyo JP
- Iwaya; Akihiko - Fuchuu JP
- Iwaya; Akihiko - Kokubunji JP
| Patent | Date |
|---|---|
| Semiconductor Module And Method For Manufacturing Semiconductor Module App 20220278039 - SAITO; Mai ; et al. | 2022-09-01 |
| Method of manufacturing semiconductor device Grant 10,020,225 - Iwaya July 10, 2 | 2018-07-10 |
| Method Of Manufacturing Semiconductor Device App 20180047629 - IWAYA; Akihiko | 2018-02-15 |
| Semiconductor device Grant 9,805,981 - Iwaya October 31, 2 | 2017-10-31 |
| Semiconductor Device App 20170062314 - IWAYA; Akihiko | 2017-03-02 |
| Semiconductor device Grant 6,617,196 - Iwaya , et al. September 9, 2 | 2003-09-09 |
| Method of fabricating a semiconductor device Grant 6,610,561 - Tsubosaki , et al. August 26, 2 | 2003-08-26 |
| Semiconductor device Grant 6,452,266 - Iwaya , et al. September 17, 2 | 2002-09-17 |
| Semiconductor device App 20020109215 - Iwaya, Akihiko ; et al. | 2002-08-15 |
| Semiconductor device App 20020056911 - Iwaya, Akihiko ; et al. | 2002-05-16 |
| Semiconductor device App 20020053732 - Iwaya, Akihiko ; et al. | 2002-05-09 |
| Semiconductor device App 20020043719 - Iwaya, Akihiko ; et al. | 2002-04-18 |
| Semiconductor device App 20010040284 - Iwaya, Akihiko ; et al. | 2001-11-15 |
| Method of fabricating a semiconductor device App 20010016371 - Tsubosaki, Kunihiro ; et al. | 2001-08-23 |
| Lead on chip semiconductor device and method of fabricating the same Grant 6,137,159 - Tsubosaki , et al. October 24, 2 | 2000-10-24 |
| Semiconductor device Grant 5,714,405 - Tsubosaki , et al. February 3, 1 | 1998-02-03 |
| Semiconductor device with lead structure within the planar area of the device Grant 5,583,375 - Tsubosaki , et al. December 10, 1 | 1996-12-10 |
| Semiconductor leadframe and its production method and plastic encapsulated semiconductor device Grant 5,437,915 - Nishimura , et al. August 1, 1 | 1995-08-01 |
| Semiconductor device having stacked lead structure Grant 5,252,854 - Arita , et al. October 12, 1 | 1993-10-12 |
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