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name:-0.012362957000732
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IWATSU; Satoshi Patent Filings

IWATSU; Satoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for IWATSU; Satoshi.The latest application filed is for "manufacturing system design assistance apparatus".

Company Profile
0.11.8
  • IWATSU; Satoshi - Tokyo JP
  • Iwatsu; Satoshi - Chiyoda-ku N/A JP
  • Iwatsu; Satoshi - Kanagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Manufacturing System Design Assistance Apparatus
App 20220164495 - IWATSU; Satoshi ;   et al.
2022-05-26
Common parameter interface generation program and parameter reading program
Grant 10,101,727 - Suzuki , et al. October 16, 2
2018-10-16
Sequence program creation device
Grant 9,747,529 - Iwatsu August 29, 2
2017-08-29
Common Parameter Interface Generation Program And Parameter Reading Program
App 20160179084 - SUZUKI; Kazuhisa ;   et al.
2016-06-23
Sequence Program Creation Device
App 20150094829 - Iwatsu; Satoshi
2015-04-02
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
Grant 7,015,131 - Iwatsu , et al. March 21, 2
2006-03-21
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
Grant 7,005,743 - Iwatsu , et al. February 28, 2
2006-02-28
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
App 20050045912 - Iwatsu, Satoshi ;   et al.
2005-03-03
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
App 20050037602 - Iwatsu, Satoshi ;   et al.
2005-02-17
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
Grant 6,812,569 - Iwatsu , et al. November 2, 2
2004-11-02
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
Grant 6,614,111 - Iwatsu , et al. September 2, 2
2003-09-02
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
App 20030022478 - Iwatsu, Satoshi ;   et al.
2003-01-30
Semiconductor device and method of production of the same
Grant 6,425,516 - Iwatsu , et al. July 30, 2
2002-07-30
Semiconductor device using bumps, method for fabricating same, and method for forming bumps
App 20020024110 - Iwatsu, Satoshi ;   et al.
2002-02-28
High capacity secondary battery of jelly roll type
Grant 5,849,431 - Kita , et al. December 15, 1
1998-12-15
Secondary battery
Grant 5,707,758 - Iwatsu , et al. January 13, 1
1998-01-13
Battery unit and battery energy billing method
Grant 5,525,890 - Iwatsu , et al. June 11, 1
1996-06-11

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