Iwata; Ronald Takao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iwata; Ronald Takao.The latest application filed is for "method for fabricating a semiconductor chip device having through-silicon-via (tsv)".
- Iwata; Ronald Takao - Hsinchu TW
- IWATA; Ronald Takao - Hukou Shiang TW
| Patent | Date |
|---|---|
| Semiconductor packaging method to save interposer Grant 7,927,919 - Fan , et al. April 19, 2 | 2011-04-19 |
| Method For Fabricating A Semiconductor Chip Device Having Through-silicon-via (tsv) App 20100167534 - IWATA; Ronald Takao | 2010-07-01 |
| Semiconductor chip device having through-silicon-via (TSV) and its fabrication method App 20090127667 - Iwata; Ronald Takao | 2009-05-21 |
| Micro BGA package having multi-chip stack App 20080087999 - Iwata; Ronald Takao | 2008-04-17 |
| SIP package with small dimension App 20080088005 - Iwata; Ronald Takao | 2008-04-17 |
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