Iwata; Ritsuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iwata; Ritsuo.The latest application filed is for "curing agent composition for epoxy resin adhesive for porous material".
- Iwata; Ritsuo - Hamamatsu-shi JP
- Iwata; Ritsuo - Hamamatsu JP
- Iwata; Ritsuo - Shizuoka-ken JP
- Iwata; Ritsuo - Shizuoka JP
| Patent | Date |
|---|---|
| Curing Agent Composition For Epoxy Resin Adhesive For Porous Material App 20130123390 - Suzuki; Katsunori ; et al. | 2013-05-16 |
| Adhesives Grant 7,074,844 - Iwata , et al. July 11, 2 | 2006-07-11 |
| Method for manufacturing ligneous material Grant 6,723,766 - Hirano , et al. April 20, 2 | 2004-04-20 |
| Adhesives App 20030204010 - Iwata, Ritsuo ; et al. | 2003-10-30 |
| Modifying method for wood elements Grant 6,632,326 - Hirano , et al. October 14, 2 | 2003-10-14 |
| Wooden material and manufacturing method therefor Grant 6,602,451 - Korai , et al. August 5, 2 | 2003-08-05 |
| Wood fiberboard and manufacturing method therefor Grant 6,376,582 - Iwata , et al. April 23, 2 | 2002-04-23 |
| Adhesives App 20010031819 - Iwata, Ritsuo ; et al. | 2001-10-18 |
| Manufacturing method for a wood board Grant 6,129,871 - Suzuki , et al. October 10, 2 | 2000-10-10 |
| Method of manufacturing wood based panels Grant 5,705,001 - Iwata , et al. January 6, 1 | 1998-01-06 |
| Wood board and flooring material Grant 5,554,429 - Iwata , et al. September 10, 1 | 1996-09-10 |
| Wood board and a flooring material made therefrom Grant 5,506,026 - Iwata , et al. April 9, 1 | 1996-04-09 |
| Wood based panels Grant 5,422,170 - Iwata , et al. June 6, 1 | 1995-06-06 |
| Automatic method and apparatus for scattering wood pieces in production of a decorative board Grant 5,058,777 - Omoto , et al. October 22, 1 | 1991-10-22 |
| Method for producing a wooden decorative article Grant 4,963,214 - Iwata , et al. October 16, 1 | 1990-10-16 |
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