Iwashige; Tomohito

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iwashige; Tomohito.The latest application filed is for "sinter sheet, semiconductor device and manufacturing method thereof".

Company Profile

8.9.14

Iwashige; Tomohito - Kariya JP
IWASHIGE; Tomohito - Kariya-city JP
IWASHIGE; Tomohito - Kariya-shi JP
Iwashige; Tomohito - Osaka JP
Iwashige; Tomohito - Ibaraki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having chips attached to support members through silver sintered bodies with particles Grant 11,101,246 - Iwashige , et al. August 24, 2	2021-08-24
Semiconductor chip and semiconductor device Grant 10,943,847 - Sugiura , et al. March 9, 2	2021-03-09
Sinter Sheet, Semiconductor Device And Manufacturing Method Thereof App 20200402944 - IWASHIGE; Tomohito ; et al.	2020-12-24
Semiconductor device Grant 10,804,237 - Sugiura , et al. October 13, 2	2020-10-13
Semiconductor Device And Method For Producing The Same App 20200312818 - IWASHIGE; Tomohito ; et al.	2020-10-01
Semiconductor device Grant 10,763,204 - Iwashige , et al. Sep	2020-09-01
Semiconductor Device App 20190214360 - SUGIURA; Kazuhiko ; et al.	2019-07-11
Semiconductor Device App 20190198441 - IWASHIGE; Tomohito ; et al.	2019-06-27
Semiconductor Chip And Semiconductor Device App 20190109067 - SUGIURA; Kazuhiko ; et al.	2019-04-11
Semiconductor device Grant 9,536,802 - Iwashige January 3, 2	2017-01-03
Semiconductor Device App 20160204046 - IWASHIGE; Tomohito	2016-07-14
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same Grant 9,340,700 - Iwashige , et al. May 17, 2	2016-05-17
Epoxy resin composition for semiconductor encapsulation Grant 8,729,715 - Iwashige , et al. May 20, 2	2014-05-20
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Using The Same App 20130127071 - SUGIMOTO; Naoya ; et al.	2013-05-23
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Using The Same App 20130062790 - IWASHIGE; Tomohito ; et al.	2013-03-14
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Using The Same App 20130026662 - IWASHIGE; Tomohito ; et al.	2013-01-31
Epoxy Resin Composition For Semiconductor Encapsulation And Semiconductor Device Obtained Using The Same App 20120153512 - SUGIMOTO; Naoya ; et al.	2012-06-21
Method Of Manufacturing Semiconductor Device App 20120115281 - Iwashige; Tomohito ; et al.	2012-05-10

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