Iwase; Teppei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iwase; Teppei.The latest application filed is for "mold, imprint device, and imprint method".
- Iwase; Teppei - Hyogo JP
- Iwase; Teppei - Neyagawa JP
- Iwase; Teppei - Osaka JP
- Iwase, Teppei - Neyagawa-shi JP
| Patent | Date |
|---|---|
| Mold, imprint device, and imprint method Grant 10,866,509 - Ishikawa , et al. December 15, 2 | 2020-12-15 |
| Film structural member Grant 10,578,775 - Fujii , et al. | 2020-03-03 |
| Mold, Imprint Device, And Imprint Method App 20180321584 - ISHIKAWA; AKIHIRO ; et al. | 2018-11-08 |
| Imprinting method and imprinting device Grant 10,105,874 - Iwase , et al. October 23, 2 | 2018-10-23 |
| Film Structural Member App 20180267209 - FUJII; KEITARO ; et al. | 2018-09-20 |
| Imprinting device Grant 9,950,463 - Ishikawa , et al. April 24, 2 | 2018-04-24 |
| Imprinting Method And Imprinting Device App 20160332341 - IWASE; TEPPEI ; et al. | 2016-11-17 |
| Imprinting Device App 20160257062 - ISHIKAWA; AKIHIRO ; et al. | 2016-09-08 |
| Optical Member And Optical Apparatus App 20150362634 - IWASE; Teppei ; et al. | 2015-12-17 |
| Expanded semiconductor chip and semiconductor device Grant 9,136,219 - Iwase , et al. September 15, 2 | 2015-09-15 |
| Semiconductor device Grant 8,766,418 - Iwase , et al. July 1, 2 | 2014-07-01 |
| Semiconductor Device App 20140124911 - IWASE; TEPPEI ; et al. | 2014-05-08 |
| Expanded Semiconductor Chip And Semiconductor Device App 20140124957 - IWASE; TEPPEI ; et al. | 2014-05-08 |
| Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool Grant 8,426,965 - Iwase , et al. April 23, 2 | 2013-04-23 |
| Semiconductor Device Mounted Structure And Its Manufacturing Method, Semiconductor Device Mounting Method, And Pressing Tool App 20120298310 - IWASE; Teppei ; et al. | 2012-11-29 |
| Semiconductor assembly and multilayer wiring board Grant 8,283,570 - Tomura , et al. October 9, 2 | 2012-10-09 |
| Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool Grant 8,264,079 - Iwase , et al. September 11, 2 | 2012-09-11 |
| Semiconductor device mounted structure with an underfill sealing-bonding resin with voids Grant 8,106,521 - Iwase , et al. January 31, 2 | 2012-01-31 |
| Semiconductor Assembly And Multilayer Wiring Board App 20110279996 - Tomura; Yoshihiro ; et al. | 2011-11-17 |
| Semiconductor device Grant 8,050,049 - Iwase , et al. November 1, 2 | 2011-11-01 |
| Semiconductor chip and semiconductor device Grant 7,994,638 - Tomura , et al. August 9, 2 | 2011-08-09 |
| Mounting process simulation system and method thereof Grant 7,904,281 - Okamoto , et al. March 8, 2 | 2011-03-08 |
| Method for analyzing component mounting board Grant 7,873,932 - Kakino , et al. January 18, 2 | 2011-01-18 |
| Semiconductor Device Mounted Structure And Semiconductor Device Mounting Method App 20110001233 - Iwase; Teppei ; et al. | 2011-01-06 |
| Semiconductor Device App 20100265683 - IWASE; Teppei ; et al. | 2010-10-21 |
| Semiconductor Device Mounted Structure And Its Manufacturing Method, Semiconductor Device Mounting Method, And Pressing Tool App 20100181667 - Iwase; Teppei ; et al. | 2010-07-22 |
| Semiconductor Device App 20100127382 - AKAHOSHI; Toshitaka ; et al. | 2010-05-27 |
| Semiconductor Chip And Semiconductor Device App 20100032832 - Tomura; Yoshihiro ; et al. | 2010-02-11 |
| Method for Analyzing Component Mounting Board App 20080168413 - Kakino; Manabu ; et al. | 2008-07-10 |
| Mounting process simulation system and method thereof App 20050038641 - Okamoto, Masaki ; et al. | 2005-02-17 |
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