Iwase; Nobuo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iwase; Nobuo.The latest application filed is for "electronic component and electronic component connecting structure".
- Iwase; Nobuo - Kamakura JP
- Iwase; Nobuo - Yokosuka JP
| Patent | Date |
|---|---|
| Electronic component and electronic component connecting structure Grant 5,907,187 - Koiwa , et al. May 25, 1 | 1999-05-25 |
| Integrated circuit device with internal inspection circuitry Grant 5,453,991 - Suzuki , et al. September 26, 1 | 1995-09-26 |
| Circuit board Grant 5,412,160 - Yasumoto , et al. May 2, 1 | 1995-05-02 |
| Circuit board Grant 5,326,623 - Yamakawa , et al. July 5, 1 | 1994-07-05 |
| Circuit board including an aluminum nitride substrate and a multilayered metal oxynitride structure Grant 5,041,700 - Iyogi , et al. August 20, 1 | 1991-08-20 |
| Electronic device having a cooling element Grant 5,008,582 - Tanuma , et al. April 16, 1 | 1991-04-16 |
| Bump and method of manufacturing the same Grant 4,970,571 - Yamakawa , et al. November 13, 1 | 1990-11-13 |
| Circuit board Grant 4,963,701 - Yasumoto , et al. October 16, 1 | 1990-10-16 |
| Method of manufacturing semiconductor device and apparatus therefor Grant 4,906,341 - Yamakawa , et al. March 6, 1 | 1990-03-06 |
| Electronic component parts and method for manufacturing the same Grant 4,835,344 - Iyogi , et al. May 30, 1 | 1989-05-30 |
| Thick film capacitor Grant 4,772,985 - Yasumoto , et al. September 20, 1 | 1988-09-20 |
| Circuit substrate having high thermal conductivity Grant 4,659,611 - Iwase , et al. April 21, 1 | 1987-04-21 |
| Production of resistor from insulating material by local heating Grant 4,584,456 - Oodaira , et al. April 22, 1 | 1986-04-22 |
| Method for manufacturing a hybrid integrated circuit device Grant 4,412,377 - Nagashima , et al. November 1, 1 | 1983-11-01 |
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