Iwasaki; Yorio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iwasaki; Yorio.The latest application filed is for "substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package".

Company Profile

0.11.0

Iwasaki; Yorio - Shimodate JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package Grant 6,236,108 - Sota , et al. May 22, 2	2001-05-22
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package Grant 6,064,111 - Sota , et al. May 16, 2	2000-05-16
Current protector Grant 5,929,741 - Nishimura , et al. July 27, 1	1999-07-27
Multiple wire adhesive on a multiple wire wiring board Grant 5,486,655 - Arike , et al. January 23, 1	1996-01-23
Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator Grant 5,403,869 - Arike , et al. April 4, 1	1995-04-04
Process for producing coaxial conductor interconnection wiring board Grant 5,323,534 - Iwasaki , et al. June 28, 1	1994-06-28
Process for producing printed wiring board Grant 5,309,632 - Takahashi , et al. May 10, 1	1994-05-10
Coaxial conductor interconnection wiring board Grant 5,233,133 - Iwasaki , et al. August 3, 1	1993-08-03
Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 PPM or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent Grant 5,053,280 - Takanezawa , et al. October 1, 1	1991-10-01
High-density wired circuit board using insulated wires Grant 4,791,238 - Kanno , et al. December 13, 1	1988-12-13
Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards Grant 4,216,246 - Iwasaki , et al. August 5, 1	1980-08-05

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