Iwasa; Shingo
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iwasa; Shingo.The latest application filed is for "wire bonding method, surface acoustic wave apparatus and method for producing surface acoustic wave apparatus".
- Iwasa; Shingo - Matto JP
- Iwasa, Shingo - Matto-shi JP
| Patent | Date |
|---|---|
| Wire bonding method Grant 6,757,946 - Takada , et al. July 6, 2 | 2004-07-06 |
| Wire bonding method, surface acoustic wave apparatus and method for producing surface acoustic wave apparatus App 20010022484 - Takada, Norihiko ; et al. | 2001-09-20 |
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