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name:-0.24276804924011
name:-0.050626039505005
Iwanaga; Shin-ichirou Patent Filings

Iwanaga; Shin-ichirou

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iwanaga; Shin-ichirou.The latest application filed is for "cell adhesion inhibitor".

Company Profile
0.6.8
  • Iwanaga; Shin-ichirou - Minato-ku JP
  • IWANAGA; Shin-ichirou - Tokyo JP
  • Iwanaga; Shin-ichirou - Chuo-ku JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Cell adhesion inhibitor
Grant 10,214,607 - Hayashi , et al. Feb
2019-02-26
Cell Adhesion Inhibitor
App 20190048113 - HAYASHI; Naoki ;   et al.
2019-02-14
Polymer, surface hydrophilizing agent containing said polymer, and manufacturing method for substrate having hydrophilic surface
Grant 9,493,600 - Hayashi , et al. November 15, 2
2016-11-15
Cell Adhesion Inhibitor
App 20160168294 - HAYASHI; Naoki ;   et al.
2016-06-16
Cell adhesion inhibitor
Grant 9,320,836 - Hayashi , et al. April 26, 2
2016-04-26
Cell Adhesion Inhibitor
App 20150017221 - Hayashi; Naoki ;   et al.
2015-01-15
New Polymer, Surface Hydrophilizing Agent Containing Said Polymer, And Manufacturing Method For Substrate Having Hydrophilic Surface
App 20140194557 - Hayashi; Naoki ;   et al.
2014-07-10
Positive photosensitive insulating resin composition and cured product thereof
Grant 7,371,500 - Inomata , et al. May 13, 2
2008-05-13
Positive Photosensitive Insulating Resin Composition And Cured Product Thereof
App 20070166632 - Inomata; Katsumi ;   et al.
2007-07-19
Positively photosensitive insulating resin composition and cured object obtained therefrom
Grant 7,214,454 - Inomata , et al. May 8, 2
2007-05-08
Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products
App 20060079609 - Nishioka; Takashi ;   et al.
2006-04-13
Positively photosensitive insulating resin composition and cured object obtained therefrom
App 20040126696 - Inomata, Katsumi ;   et al.
2004-07-01

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