IWAMURA; Kazuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for IWAMURA; Kazuki.The latest application filed is for "polyamide resin composition for foam molding and foam molded body".
- IWAMURA; Kazuki - Shiga JP
- Iwamura; Kazuki - Osaka JP
- Iwamura; Kazuki - Otsu JP
- IWAMURA; Kazuki - Otsu-shi Shiga
| Patent | Date |
|---|---|
| Polyamide Resin Composition For Foam Molding And Foam Molded Body App 20220251381 - IWAMURA; Kazuki ; et al. | 2022-08-11 |
| Polyamide-based Resin Composition For Injection Molding And Sliding Component Formed Therefrom App 20220227995 - IWAMURA; Kazuki ; et al. | 2022-07-21 |
| Control Device For Power Conversion Apparatus App 20210297007 - Sawano; Tomohiro ; et al. | 2021-09-23 |
| Conductive polyamide resin composition Grant 10,934,432 - Kubota , et al. March 2, 2 | 2021-03-02 |
| Polyamide resin composition Grant 10,676,616 - Yoshimura , et al. | 2020-06-09 |
| Conductive Polyamide Resin Composition App 20200010678 - KUBOTA; Shuji ; et al. | 2020-01-09 |
| Polyamide Resin Composition App 20190345331 - YOSHIMURA; Nobuhiro ; et al. | 2019-11-14 |
| Component For Fuel Feed Apparatus App 20180222314 - SAKAI; Kiyofumi ; et al. | 2018-08-09 |
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