Patent | Date |
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Chip-shaped electronic component Grant 11,081,263 - Iwamura , et al. August 3, 2 | 2021-08-03 |
Chip-shaped Electronic Component App 20200126695 - IWAMURA; Eiji ;   et al. | 2020-04-23 |
Heat dissipating coating composition and heat dissipating coating film Grant 9,346,993 - Iwamura , et al. May 24, 2 | 2016-05-24 |
Lead-free solder flux and lead-free solder paste Grant 9,314,879 - Kubo , et al. April 19, 2 | 2016-04-19 |
Heat-dissapating Powder Coating Composition, Heat-dissipating Coating Film, And Coated Article App 20160024366 - IWAMURA; Eiji ;   et al. | 2016-01-28 |
Heat Dissipating Coating Composition And Heat Dissipating Coating Film App 20150010759 - Iwamura; Eiji ;   et al. | 2015-01-08 |
Lead-free Solder Flux And Lead-free Solder Paste App 20130276937 - Kubo; Natsuki ;   et al. | 2013-10-24 |
Electrode and its fabrication method for semiconductor devices, and sputtering target for forming electrode film for semiconductor devices Grant RE44,239 - Yamamoto , et al. May 28, 2 | 2013-05-28 |
Carbon-based thin film, and process for producing the same, and member using the thin film Grant 8,323,752 - Iwamura December 4, 2 | 2012-12-04 |
Flux For Solder Paste, And Solder Paste App 20120291921 - Iwamura; Eiji ;   et al. | 2012-11-22 |
Solder Paste App 20120291922 - Iwamura; Eiji ;   et al. | 2012-11-22 |
Aluminum alloy electrode for semiconductor devices Grant RE43,590 - Yamamoto , et al. August 21, 2 | 2012-08-21 |
Hydrogen storage materials and process for the preparation of the same Grant 8,178,471 - Iwamura May 15, 2 | 2012-05-15 |
Hydrogen storage materials and process for the preparation of the same App 20060014638 - Iwamura; Eiji | 2006-01-19 |
Connection/inspection device for semiconductor elements Grant 6,815,962 - Hirano , et al. November 9, 2 | 2004-11-09 |
Multilayer film formed body Grant 6,716,540 - Kohara , et al. April 6, 2 | 2004-04-06 |
Onion-like carbon film and its production Grant 6,599,492 - Iwamura , et al. July 29, 2 | 2003-07-29 |
Diamond-like carbon hard multilayer film and component excellent in wear resistance and sliding performance Grant 6,562,445 - Iwamura May 13, 2 | 2003-05-13 |
Electric connection-inspection device App 20030034782 - Hirano, Takayuki ;   et al. | 2003-02-20 |
Multilayer film formed body App 20020136895 - Kohara, Toshimitsu ;   et al. | 2002-09-26 |
Onion-like carbon film and its production App 20020061397 - Iwamura, Eiji ;   et al. | 2002-05-23 |
Diamond-like carbon hard multilayer film and component excellent in wear resistance and sliding performance App 20010031346 - Iwamura, Eiji | 2001-10-18 |
Electrode and its fabrication method for semiconductor devices, and sputtering target for forming electrode film for semiconductor devices Grant 6,033,542 - Yamamoto , et al. March 7, 2 | 2000-03-07 |
Aluminum alloy electrode for semiconductor devices Grant 5,514,909 - Yamamoto , et al. May 7, 1 | 1996-05-07 |
Cathode-ray tube socket substrate Grant 4,402,037 - Iwamura , et al. August 30, 1 | 1983-08-30 |