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Patent applications and USPTO patent grants for Iwama; Nobuhiro.The latest application filed is for "plasma processing apparatus".
Patent | Date |
---|---|
Plasma processing apparatus Grant 8,251,011 - Yamazawa , et al. August 28, 2 | 2012-08-28 |
Method and system for etching a high-k dielectric material Grant 7,709,397 - Chen , et al. May 4, 2 | 2010-05-04 |
Plasma processing apparatus Grant 7,527,016 - Yamazawa , et al. May 5, 2 | 2009-05-05 |
Plasma Processing Apparatus App 20070236148 - Yamazawa; Yohei ;   et al. | 2007-10-11 |
Plasma process apparatus App 20070113787 - Higashiura; Tsutomu ;   et al. | 2007-05-24 |
Plasma processing apparatus App 20060037702 - Hayashi; Daisuke ;   et al. | 2006-02-23 |
Method and system for substrate temperature profile control App 20060027169 - Tsukamoto; Yuji ;   et al. | 2006-02-09 |
Method and system for etching a high-k dielectric material App 20050164511 - Chen, Lee ;   et al. | 2005-07-28 |
Method and system for etching a high-k dielectric material App 20050118353 - Chen, Lee ;   et al. | 2005-06-02 |
Plasma process apparatus App 20040255863 - Higashiura, Tsutomu ;   et al. | 2004-12-23 |
Plasma processing apparatus App 20040035365 - Yamazawa, Yohei ;   et al. | 2004-02-26 |
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