Iwakura; Ken
Patent Applications and Registrations
Patent applications and USPTO patent grants for Iwakura; Ken.The latest application filed is for "method and apparatuses for inductive coupling signal transmission".
- Iwakura; Ken - Tokyo JP
- Iwakura; Ken - Sagamihara JP
- Iwakura; Ken - Chuo-ku N/A JP
- Iwakura; Ken - Shizuoka JP
- Iwakura; Ken - Kanagawa JP
- Iwakura; Ken - Minami-ashigara JP
| Patent | Date |
|---|---|
| Method and apparatus for inductive coupling signal transmission Grant 10,673,490 - Iwakura | 2020-06-02 |
| Method And Apparatuses For Inductive Coupling Signal Transmission App 20180316393 - IWAKURA; KEN | 2018-11-01 |
| Method and apparatus for inductive coupling signal transmission Grant 10,027,381 - Iwakura July 17, 2 | 2018-07-17 |
| Method And Apparatus For Inductive Coupling Signal Transmission App 20180034514 - Iwakura; Ken | 2018-02-01 |
| Semiconductor package with bonding wires of reduced loop inductance Grant 9,595,489 - Katagiri , et al. March 14, 2 | 2017-03-14 |
| Semiconductor device stack with bonding layer and wire retaining member Grant 8,970,052 - Hasegawa , et al. March 3, 2 | 2015-03-03 |
| Semiconductor Device App 20150022255 - KATAGIRI; Mitsuaki ; et al. | 2015-01-22 |
| Semiconductor device Grant 8,853,822 - Katagiri , et al. October 7, 2 | 2014-10-07 |
| Semiconductor Package With Bonding Wires Of Reduced Loop Inductance App 20140103542 - KATAGIRI; Mitsuaki ; et al. | 2014-04-17 |
| Test method and interposer used therefor Grant 8,680,881 - Uematsu , et al. March 25, 2 | 2014-03-25 |
| Semiconductor Device Stack With Bonding Layer And Wire Retaining Member App 20140035166 - HASEGAWA; Yu ; et al. | 2014-02-06 |
| Semiconductor package with bonding wires of reduced loop inductance Grant 8,633,596 - Katagiri , et al. January 21, 2 | 2014-01-21 |
| Semiconductor device stack with bonding layer and wire retaining member Grant 8,581,417 - Hasegawa , et al. November 12, 2 | 2013-11-12 |
| Semiconductor Device App 20130140674 - KATAGIRI; Mitsuaki ; et al. | 2013-06-06 |
| Semiconductor Device App 20120200159 - KATAGIRI; Mitsuaki ; et al. | 2012-08-09 |
| Semiconductor Package With Bonding Wires Of Reduced Loop Inductance App 20120119387 - KATAGIRI; Mitsuaki ; et al. | 2012-05-17 |
| Test Method And Interposer Used Therefor App 20110234249 - UEMATSU; Yutaka ; et al. | 2011-09-29 |
| Semiconductor package substrate and semiconductor device having the same App 20110084395 - Takeda; Hiromasa ; et al. | 2011-04-14 |
| Semiconductor Device App 20100193929 - IWAKURA; Ken ; et al. | 2010-08-05 |
| Semiconductor Device And Method Of Manufacturing The Semiconductor Device App 20100193933 - HASEGAWA; Yu ; et al. | 2010-08-05 |
| Semiconductor device or printed wiring board design method and design support system that implements settings by using a semiconductor device model that expresses parasitic elements that occur when packaged App 20090327981 - Nakamura; Satoshi ; et al. | 2009-12-31 |
| Heat-sensitive recording material Grant 5,286,703 - Wachi , et al. February 15, 1 | 1994-02-15 |
| Heat-sensitive recording material Grant 5,260,253 - Kawakami , et al. November 9, 1 | 1993-11-09 |
| Optical image-recording material Grant 5,051,333 - Yanagihara , et al. September 24, 1 | 1991-09-24 |
| Recording material Grant 4,981,835 - Iwakura , et al. January 1, 1 | 1991-01-01 |
| Heat-sensitive recording materials Grant 4,888,321 - Kawakami , et al. December 19, 1 | 1989-12-19 |
| Recording material Grant 4,876,233 - Saeki , et al. October 24, 1 | 1989-10-24 |
| Heat-sensitive recording material Grant 4,871,713 - Matsuoka , et al. * October 3, 1 | 1989-10-03 |
| Recording material Grant 4,861,748 - Saeki , et al. August 29, 1 | 1989-08-29 |
| Recording material Grant 4,847,236 - Satomura , et al. July 11, 1 | 1989-07-11 |
| Recording material Grant 4,835,133 - Yanagihara , et al. May 30, 1 | 1989-05-30 |
| Recording materials Grant 4,771,034 - Ikeda , et al. September 13, 1 | 1988-09-13 |
| Heat-sensitive recording materials Grant 4,480,052 - Ichijima , et al. October 30, 1 | 1984-10-30 |
| Heat-sensitive recording materials Grant 4,446,209 - Iwakura , et al. May 1, 1 | 1984-05-01 |
| Image recording members Grant 4,436,920 - Sato , et al. March 13, 1 | 1984-03-13 |
| Process for preparing fluoran derivatives Grant 4,433,156 - Ishige , et al. February 21, 1 | 1984-02-21 |
| Desensitizer compositions Grant 4,411,699 - Iwakura , et al. October 25, 1 | 1983-10-25 |
| Image recording members Grant 4,390,616 - Sato , et al. June 28, 1 | 1983-06-28 |
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