loadpatents
name:-0.024102926254272
name:-0.02667498588562
name:-0.00061917304992676
IWAKI; HIDEKI Patent Filings

IWAKI; HIDEKI

Patent Applications and Registrations

Patent applications and USPTO patent grants for IWAKI; HIDEKI.The latest application filed is for "protection system".

Company Profile
0.20.18
  • IWAKI; HIDEKI - Osaka JP
  • Iwaki; Hideki - Kanagawa JP
  • Iwaki; Hideki - Ibaraki JP
  • Iwaki; Hideki - Ibaraki-shi JP
  • Iwaki, Hideki - Ibaraki city JP
  • Iwaki; Hideki - Neyagawa JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Protection System
App 20220158433 - IWAKI; HIDEKI ;   et al.
2022-05-19
Circuit board
Grant 10,575,396 - Shiozaki , et al. Feb
2020-02-25
Antenna module
Grant 10,141,658 - Yamamoto , et al. Nov
2018-11-27
Antenna device using EBG structure, wireless communication device, and radar device
Grant 10,122,074 - Tagi , et al. November 6, 2
2018-11-06
Circuit Board
App 20180279466 - SHIOZAKI; RYOSUKE ;   et al.
2018-09-27
Antenna device, wireless communication apparatus, and radar apparatus
Grant 10,014,572 - Tagi , et al. July 3, 2
2018-07-03
Antenna device using EBG structure, wireless communication device, and radar device
Grant 9,960,485 - Tagi , et al. May 1, 2
2018-05-01
Antenna Module
App 20170346195 - YAMAMOTO; CHIE ;   et al.
2017-11-30
Antenna Device, Wireless Communication Apparatus, And Radar Apparatus
App 20160344093 - TAGI; HIROYOSHI ;   et al.
2016-11-24
Antenna Device Using Ebg Structure, Wireless Communication Device, And Radar Device
App 20160141749 - TAGI; HIROYOSHI ;   et al.
2016-05-19
Antenna Device Using Ebg Structure, Wireless Communication Device, And Radar Device
App 20160141748 - TAGI; HIROYOSHI ;   et al.
2016-05-19
Semiconductor device and manufacturing process thereof
Grant 8,344,264 - Kumano , et al. January 1, 2
2013-01-01
Noise reduction circuit for canceling leakage signal
Grant 8,290,451 - Komatsu , et al. October 16, 2
2012-10-16
Circuit wiring interference analysis device, interference analysis program, database used in interference analysis device, and asymmetrically connected line model
Grant 7,814,445 - Iwaki , et al. October 12, 2
2010-10-12
Interference analysis method, interference analysis device, interference analysis program and recording medium with interference analysis program recorded thereon
Grant 7,788,076 - Iwaki , et al. August 31, 2
2010-08-31
Semiconductor Device And Manufacturing Process Thereof
App 20090321124 - KUMANO; Yutaka ;   et al.
2009-12-31
Noise Reduction Circuit For Canceling Leakage Signal
App 20090174476 - Komatsu; Naoki ;   et al.
2009-07-09
Circuit Wiring Interference Analysis Device, Interference Analysis Program, Database Used In Interference Analysis Device, And Asymmetrically Connected Line Model
App 20090019403 - Iwaki; Hideki ;   et al.
2009-01-15
Semiconductor module
Grant 7,385,286 - Iwaki , et al. June 10, 2
2008-06-10
Circuit board design system, design data analysis method and recording medium with analysis program recorded thereon
Grant 7,350,175 - Iwaki , et al. March 25, 2
2008-03-25
Slave device, master device and stacked device
Grant 7,346,051 - Nakayama , et al. March 18, 2
2008-03-18
Semiconductor built-in millimeter-wave band module
Grant 7,061,100 - Iwaki , et al. June 13, 2
2006-06-13
Circuit board design system, design data analysis method and recording medium with analysis program recorded thereon
App 20060070015 - Iwaki; Hideki ;   et al.
2006-03-30
Slave device, master device and stacked device
App 20050289269 - Nakayama, Takeshi ;   et al.
2005-12-29
Interference analysis method, interference analysis device, interference analysis program and recording medium with interference analysis program recorded thereon
App 20050197817 - Iwaki, Hideki ;   et al.
2005-09-08
Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module
Grant 6,885,788 - Iwaki , et al. April 26, 2
2005-04-26
Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor
Grant 6,870,264 - Iwaki , et al. March 22, 2
2005-03-22
Optical module
Grant 6,789,956 - Iwaki , et al. September 14, 2
2004-09-14
Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling of member the module
App 20040001661 - Iwaki, Hideki ;   et al.
2004-01-01
Semiconductor built -in millimeter-wave band module
App 20030189246 - Iwaki, Hideki ;   et al.
2003-10-09
Optical module
App 20030123815 - Iwaki, Hideki ;   et al.
2003-07-03
Semiconductor module
App 20020180063 - Iwaki, Hideki ;   et al.
2002-12-05
Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor
Grant 6,392,164 - Iwaki , et al. May 21, 2
2002-05-21
Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor
App 20020034839 - Iwaki, Hideki ;   et al.
2002-03-21
Semiconductor device and method of manufacturing the same
Grant 6,348,739 - Taguchi , et al. February 19, 2
2002-02-19
Semiconductor device and method of manufacturing the same
App 20010019173 - Taguchi, Yutaka ;   et al.
2001-09-06
Electronic part and a method of production thereof
Grant 6,154,940 - Onishi , et al. December 5, 2
2000-12-05
Electronic part and a method of production thereof
Grant 5,920,142 - Onishi , et al. July 6, 1
1999-07-06

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