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Iwai; Teruo Patent Filings

Iwai; Teruo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Iwai; Teruo.The latest application filed is for "mold, method for manufacturing molded foam body, and molded foam body".

Company Profile
1.4.3
  • Iwai; Teruo - Yokohama JP
  • Iwai; Teruo - Yokohama-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Mold, method for manufacturing molded foam body, and molded foam body
Grant 10,391,686 - Kuroki , et al. A
2019-08-27
Mold, method for manufacturing molded foam body, and molded foam body
Grant 10,099,409 - Kuroki , et al. October 16, 2
2018-10-16
Mold, Method For Manufacturing Molded Foam Body, And Molded Foam Body
App 20150021804 - Kuroki; Hiroyuki ;   et al.
2015-01-22
Mold, Method For Manufacturing Molded Foam Body, And Molded Foam Body
App 20150001754 - Kuroki; Hiroyuki ;   et al.
2015-01-01
Formation of foamed resin article
Grant 8,066,253 - Ohta , et al. November 29, 2
2011-11-29
Formation of foamed resin article
App 20050269724 - Ohta, Masato ;   et al.
2005-12-08
Molding die and molding process for synthetic resin molded foam
Grant 6,036,899 - Iwai , et al. March 14, 2
2000-03-14

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