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Patent applications and USPTO patent grants for Iwabuchi; Mitsuru.The latest application filed is for "solder composition and electronic board".
Patent | Date |
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Solder composition and electronic board Grant 10,449,638 - Ichikawa , et al. Oc | 2019-10-22 |
Solder Composition And Electronic Board App 20170282304 - Ichikawa; Daigo ;   et al. | 2017-10-05 |
Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder composition App 20040211291 - Ono, Takao ;   et al. | 2004-10-28 |
Lead-free solder, and paste solder composition Grant 6,726,780 - Ono , et al. April 27, 2 | 2004-04-27 |
Process of producing metal powders App 20030177865 - Ono, Takao ;   et al. | 2003-09-25 |
Lead-free solder, and paste solder composition App 20030178101 - Ono, Takao ;   et al. | 2003-09-25 |
Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder composition App 20030047034 - Ono, Takao ;   et al. | 2003-03-13 |
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