ITOKAWA; Hajime
Patent Applications and Registrations
Patent applications and USPTO patent grants for ITOKAWA; Hajime.The latest application filed is for "resin substrate having dielectric characteristics with little frequency dependence".
- ITOKAWA; Hajime - Annaka-shi JP
| Patent | Date |
|---|---|
| Resin Substrate Having Dielectric Characteristics With Little Frequency Dependence App 20220275158 - SHIOBARA; Toshio ; et al. | 2022-09-01 |
| Low Dielectric Resin Substrate App 20210403672 - SHIOBARA; Toshio ; et al. | 2021-12-30 |
| Low Dielectric Silica Powder, Resin Composition Containing The Silica Powder, And Method For Manufacturing Low Dielectric Silica Powder App 20210371666 - SHIOBARA; Toshio ; et al. | 2021-12-02 |
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