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Itokawa; Akinori Patent Filings

Itokawa; Akinori

Patent Applications and Registrations

Patent applications and USPTO patent grants for Itokawa; Akinori.The latest application filed is for "wired circuit board and connection structure between wired circuit boards".

Company Profile
0.4.4
  • Itokawa; Akinori - Osaka JP
  • Itokawa; Akinori - Ibaraki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wired circuit board and connection structure between wired circuit boards
Grant 8,174,844 - Kanagawa , et al. May 8, 2
2012-05-08
Printed circuit board and electronic component device
Grant 7,985,926 - Nishi , et al. July 26, 2
2011-07-26
Wired circuit board and connection structure between wired circuit boards
App 20100157560 - Kanagawa; Hitoki ;   et al.
2010-06-24
Printed Circuit Board And Electronic Component Device
App 20080099237 - NISHI; Kensuke ;   et al.
2008-05-01
Flexible wired circuit board
Grant 7,307,854 - Itokawa December 11, 2
2007-12-11
Method for manufacturing double-sided printed circuit board
Grant 7,281,327 - Takayoshi , et al. October 16, 2
2007-10-16
Method for manufacturing double-sided printed circuit board
App 20060016072 - Takayoshi; Yuichi ;   et al.
2006-01-26
Flexible wired circuit board
App 20040174663 - Itokawa, Akinori
2004-09-09

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