ITO; Teppei
Patent Applications and Registrations
Patent applications and USPTO patent grants for ITO; Teppei.The latest application filed is for "dental addition silicone composition".
- ITO; Teppei - Tokyo JP
- Ito; Teppei - Reynoldsburg OH
- ITO; Teppei - Shioya-gun JP
- Ito; Teppei - Tochigi JP
- Ito; Teppei - Utsunomiya-shi JP
| Patent | Date |
|---|---|
| Dental Addition Silicone Composition App 20220160590 - KAMINOSONO; Yoshiya ; et al. | 2022-05-26 |
| Vehicle seat Grant 11,117,500 - Hage-Hassan , et al. September 14, 2 | 2021-09-14 |
| Vehicle Seat App 20210129717 - HAGE-HASSAN; Souheil ; et al. | 2021-05-06 |
| Vehicle Seat App 20210086672 - ITO; Teppei | 2021-03-25 |
| Vehicle seat Grant 10,864,834 - Ito December 15, 2 | 2020-12-15 |
| Vehicle Seat App 20190366895 - ITO; Teppei | 2019-12-05 |
| Vehicle seat with pad having a through-opening for harness Grant 10,399,471 - Ito Sep | 2019-09-03 |
| Vehicle seat Grant 10,086,727 - Ruff , et al. October 2, 2 | 2018-10-02 |
| Vehicle Seat App 20180272905 - Ruff; Jeremy ; et al. | 2018-09-27 |
| Seat for vehicle Grant 10,023,082 - Ito July 17, 2 | 2018-07-17 |
| Vehicle Seat App 20170320417 - ITO; Teppei | 2017-11-09 |
| Vehicle seat Grant 9,738,193 - Ito August 22, 2 | 2017-08-22 |
| Tether Anchor Bracket App 20170028880 - Ito; Teppei | 2017-02-02 |
| Seat For Vehicle App 20160325648 - Ito; Teppei | 2016-11-10 |
| Vehicle Seat App 20160280109 - ITO; Teppei | 2016-09-29 |
| Seat for vehicle Grant 9,415,709 - Ito August 16, 2 | 2016-08-16 |
| Seat For Vehicle App 20150306989 - Ito; Teppei | 2015-10-29 |
| Vehicle Seat App 20150291072 - ITO; Teppei | 2015-10-15 |
| Stowable rear seat Grant 9,126,503 - Ito September 8, 2 | 2015-09-08 |
| Seat Mounting Structure App 20150083872 - Ito; Teppei ; et al. | 2015-03-26 |
| Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body Grant 8,871,660 - Yoshizaki , et al. October 28, 2 | 2014-10-28 |
| Stowable rear seat Grant 8,783,753 - Ito , et al. July 22, 2 | 2014-07-22 |
| Stowable Rear Seat App 20130313849 - Ito; Teppei | 2013-11-28 |
| Stowable Rear Seat App 20130278005 - Ito; Teppei ; et al. | 2013-10-24 |
| Method For Manufacturing Base Material Having Gold-plated Metal Fine Pattern, Base Material Having Gold-plated Metal Fine Pattern, Printed Wiring Board, Interposer, And Semiconductor Device App 20130058062 - Tachibana; Kenya ; et al. | 2013-03-07 |
| Electroless Copper Plating Method, Printed Wiring Board, Method For Producing The Same, And Semiconductor Device App 20110120760 - Okada; Ryoichi ; et al. | 2011-05-26 |
| Method For Electroless Nickel-palladium-gold Plating, Plated Product, Printed Wiring Board, Interposer And Semiconductor Apparatus App 20110051387 - TACHIBANA; Kenya ; et al. | 2011-03-03 |
| Substrate And Semiconductor Device App 20100258938 - Ito; Teppei ; et al. | 2010-10-14 |
| Laminated Body, Circuit Board Including Laminated Body, Semiconductor Package And Process For Manufacturing Laminated Body App 20100078201 - Yoshizaki; Kazuyuki ; et al. | 2010-04-01 |
| Semiconductor Package, Method Of Production Thereof And Encapsulation Resin App 20080036097 - Ito; Teppei ; et al. | 2008-02-14 |
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