ITO; Meguru

Patent Applications and Registrations

Patent applications and USPTO patent grants for ITO; Meguru.The latest application filed is for "resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board".

Company Profile

8.11.14

ITO; Meguru - Tokyo JP
ITO; Meguru - US
Ito; Meguru - Katsushika-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20220076859 - TOMIZAWA; Katsuya ; et al.	2022-03-10
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board Grant 11,195,638 - Tomizawa , et al. December 7, 2	2021-12-07
Resin composition, prepreg, metal foil-clad laminate, and printed circuit board Grant 10,869,390 - Ohnishi , et al. December 15, 2	2020-12-15
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board Grant 10,815,349 - Tomizawa , et al. October 27, 2	2020-10-27
Resin Composition, Prepreg, Laminate, Metal Foil-clad Laminate, Printed Wiring Board, And Multilayer Printed Wiring Board App 20200325292 - HAMAJIMA; Tomoki ; et al.	2020-10-15
Prepreg, metal foil-clad laminate, and printed wiring board Grant 10,791,626 - Hamajima , et al. September 29, 2	2020-09-29
Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same Grant 10,717,837 - Tomizawa , et al.	2020-07-21
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board Grant 10,676,579 - Tomizawa , et al.	2020-06-09
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20200152349 - TOMIZAWA; Katsuya ; et al.	2020-05-14
Resin composition, prepreg, metal foil-clad laminate, and printed circuit board Grant 10,550,228 - Kashima , et al. Fe	2020-02-04
Insulating layer for printed circuit board and printed circuit board Grant 10,292,260 - Tomizawa , et al.	2019-05-14
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20180197655 - TOMIZAWA; Katsuya ; et al.	2018-07-12
Resin Composition, Prepreg, Metal Foil-clad Laminate, And Printed Circuit Board App 20180199435 - OHNISHI; Nobuyoshi ; et al.	2018-07-12
Resin Composition, Prepreg, Metal Foil-clad Laminate, And Printed Circuit Board App 20180186933 - KASHIMA; Naoki ; et al.	2018-07-05
Resin Composition And Prepreg, Resin Sheet, Laminate, And Printed Circuit Board Comprising Same App 20180179354 - TOMIZAWA; Katsuya ; et al.	2018-06-28
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20180179355 - TOMIZAWA; Katsuya ; et al.	2018-06-28
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20180155514 - TOMIZAWA; Katsuya ; et al.	2018-06-07
Vehicle exterior environment recognition apparatus Grant 9,904,860 - Kasaoki , et al. February 27, 2	2018-02-27
Vehicle Exterior Environment Recognition Apparatus App 20170091566 - KASAOKI; Seisuke ; et al.	2017-03-30
Resin composition, prepreg, and laminate Grant 9,512,329 - Nobukuni , et al. December 6, 2	2016-12-06
Insulating Layer For Printed Circuit Board, And Printed Circuit Board App 20160309582 - TOMIZAWA; Katsuya ; et al.	2016-10-20
Prepreg, Metal Foil-clad Laminate, And Printed Circuit Board App 20160219700 - HAMAJIMA; Tomoki ; et al.	2016-07-28
Resin Composition, Prepreg, And Laminate App 20140227924 - Nobukuni; Takeshi ; et al.	2014-08-14

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