ITEQ CORPORATION
Patent Applications and Registrations
Patent applications and USPTO patent grants for ITEQ CORPORATION.The latest application filed is for "polymer matrix composite, prepreg and printed circuit board for eliminating skew and fiber weave effect".
Company Profile
12.30.36
- ITEQ CORPORATION - Hsinchu County TW
- ITEQ CORPORATION - Xinpu Township, Hsinchu County N/A TW
- ITEQ CORPORATION - Xinpu Township Hsinchu County TW
- ITEQ Corporation - Taoyuan TW
- ITEQ CORPORATION - Taoyuan County N/A TW
- ITEQ CORPORATION - Ping Chen TW
- ITEQ CORPORATION - Ping Chen City TW
- ITEQ CORPORATION -
- ITEQ CORPORATION - Ping Che TW
Patent Activity
| Patent | Date |
|---|---|
| Polymer Matrix Composite, Prepreg And Printed Circuit Board For Eliminating Skew And Fiber Weave Effect App 20220153945 - AMLA; TARUN ; et al. | 2022-05-19 |
| Resin Composition, Prepreg, And Printed Circuit Board App 20210298169 - WU; YEN-HSING ; et al. | 2021-09-23 |
| Prepreg, Laminated And Printed Circuit Board Thereof App 20210147646 - LIU; MING ; et al. | 2021-05-20 |
| Polymer Matrix Composite, Prepreg And Printed Circuit Board For Eliminating Skew And Fiber Weave Effect App 20200413536 - AMLA; TARUN ; et al. | 2020-12-31 |
| Thermally conductive resin, resin composition, prepreg, and copper clad laminate Grant 10,752,744 - Tseng , et al. A | 2020-08-25 |
| Resin composition, prepreg, and copper clad laminate Grant 10,696,783 - Cheng , et al. June 30, 2 | 2020-06-30 |
| Halogen-free epoxy resin composition having low dielectric loss Grant 10,611,910 - Chen , et al. | 2020-04-07 |
| Laminated substrate Grant 10,518,503 - Yu , et al. Dec | 2019-12-31 |
| Multi-layered Structure And Substrate App 20190390061 - CHENG; Chen-Hsi ; et al. | 2019-12-26 |
| Laminated Substrate App 20190202168 - YU; TA-YUAN ; et al. | 2019-07-04 |
| Thermally Conductive Resin, Resin Composition, Prepreg, And Copper Clad Laminate App 20190194408 - TSENG; Feng-Po ; et al. | 2019-06-27 |
| Resin Composition, Prepreg, And Copper Clad Laminate App 20190194383 - CHENG; Chen-Hsi ; et al. | 2019-06-27 |
| Polymer Matrix Composite For Eliminating Skew And Fiber Weave Effect App 20190104612 - AMLA; TARUN | 2019-04-04 |
| Halogen-free Epoxy Resin Composition Having Low Dielectric Loss App 20180223094 - CHEN; Kai-Yang ; et al. | 2018-08-09 |
| Polyimide resins containing polymaleic anhydride and method for manufacturing the same Grant 9,771,456 - Kuo , et al. September 26, 2 | 2017-09-26 |
| Electromagnetic interference shielding film Grant 9,674,992 - Cheng June 6, 2 | 2017-06-06 |
| Low dielectric materials Grant 9,455,067 - Yin , et al. September 27, 2 | 2016-09-27 |
| Low Dielectric Materials App 20160148719 - YIN; MENG-SONG ; et al. | 2016-05-26 |
| Dielectric material with low dielectric loss Grant 9,257,212 - Yin , et al. February 9, 2 | 2016-02-09 |
| Circuit board Grant 9,245,667 - Yin , et al. January 26, 2 | 2016-01-26 |
| Electromagnetic Interference Shielding Film App 20160007510 - CHENG; Chen-Hsi | 2016-01-07 |
| Halogen-free Low-expansion Resin Composition App 20150148450 - Tang; Feng ; et al. | 2015-05-28 |
| Halogen-free Epoxy Resin Composition For Integrated Circuit Packaging App 20150148453 - Tang; Feng ; et al. | 2015-05-28 |
| Halogen-free High-frequency Resin Composition App 20150147799 - Li; Hailin ; et al. | 2015-05-28 |
| Organic-inorganic Hybrid Material Film And Method For Manufacturing The Same App 20150038039 - KUO; Chao-Hui ; et al. | 2015-02-05 |
| Polyimide Resins Containing Polymaleic Anhydride And Method For Manufacturing The Same App 20150004862 - KUO; Chao-Hui ; et al. | 2015-01-01 |
| Dielectric Material With Low Dielectric Loss App 20140275377 - YIN; Meng-Song ; et al. | 2014-09-18 |
| Circuit Board App 20140275335 - YIN; Meng-Song ; et al. | 2014-09-18 |
| Electromagnetic Interference Shielding Structure App 20140093722 - SUNG; Yun-Hsing | 2014-04-03 |
| Varnish composition, and pre-impregnated manufacture thereof Grant 8,663,803 - Chen , et al. March 4, 2 | 2014-03-04 |
| Thermosetting resin composition Grant 8,217,099 - He , et al. July 10, 2 | 2012-07-10 |
| Varnish, prepreg, and substrate thereof Grant 8,206,819 - Liu June 26, 2 | 2012-06-26 |
| Halogen-free prepreg and resin for preparing the same Grant 8,153,709 - Jian , et al. April 10, 2 | 2012-04-10 |
| Kind of prepolymer and its product-thermosetting resins composite Grant 8,104,148 - He , et al. January 31, 2 | 2012-01-31 |
| Varnish, prepreg, and substrate thereof Grant 8,088,490 - Chen January 3, 2 | 2012-01-03 |
| Varnish and prepreg, and substrates thereof Grant 8,058,363 - Jian , et al. November 15, 2 | 2011-11-15 |
| Thermosetting resin for expediting a thermosetting process Grant 8,017,671 - Yuan , et al. September 13, 2 | 2011-09-13 |
| Varnish, Prepreg, And Substrate Thereof App 20110183144 - LIU; LAI TU | 2011-07-28 |
| Prepreg and resin for preparing the same Grant 7,955,701 - Jian , et al. June 7, 2 | 2011-06-07 |
| Varnish, Prepreg, And Substrate Thereof App 20110097587 - Chen; Li-Chun | 2011-04-28 |
| Halogen-free varnish and prepreg thereof Grant 7,842,401 - Chen November 30, 2 | 2010-11-30 |
| Halogen-free Vanish And Prepreg Thereof App 20100248570 - Chen; Li-Chun | 2010-09-30 |
| Resin composition and application thereof Grant 7,786,029 - Chen , et al. August 31, 2 | 2010-08-31 |
| Prepreg And Resin For Preparing The Same App 20100159765 - JIAN; Bin ; et al. | 2010-06-24 |
| Halogen-free Prepreg And Resin For Preparing The Same App 20100155123 - JIAN; Bin ; et al. | 2010-06-24 |
| Brightness Enhancement Component App 20100046103 - YEH; Tou-Sheng ; et al. | 2010-02-25 |
| Method of Inhibiting the Growth of Algae App 20090280984 - Kao; Chih-Ta | 2009-11-12 |
| Method of inhibition the growth of algae Grant 7,612,049 - Kao November 3, 2 | 2009-11-03 |
| Brightness Enhancement Component App 20090231859 - Yeh; Tou-Sheng ; et al. | 2009-09-17 |
| Method of Inhibition the Growth of Algae App 20090124575 - Kao; Chih-Ta | 2009-05-14 |
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