ITAKURA; Katsuhiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for ITAKURA; Katsuhiro.The latest application filed is for "wafer holding body".

Company Profile

2.10.27

ITAKURA; Katsuhiro - Itami-shi JP
Itakura; Katsuhiro - Itami JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer Holding Body App 20210074568 - KIMURA; Koichi ; et al.	2021-03-11
Wafer holding unit Grant 10,886,157 - Kimura , et al. January 5, 2	2021-01-05
Wafer Holding Unit App 20180174878 - KIMURA; Koichi ; et al.	2018-06-21
Heater Unit, Heating And Cooling Device, And Apparatus Comprising Same App 20110139399 - ITAKURA; Katsuhiro ; et al.	2011-06-16
Wafer holder for wafer prober and wafer prober equipped with the same Grant 7,855,569 - Natsuhara , et al. December 21, 2	2010-12-21
Wafer holder, and wafer prober provided therewith Grant 7,576,303 - Natsuhara , et al. August 18, 2	2009-08-18
Wafer holder, heater unit used for wafer prober having the wafer holder, and wafer prober having the heater unit App 20090050621 - Awazu; Tomoyuki ; et al.	2009-02-26
Body for keeping a wafer, heater unit and wafer prober Grant 7,495,460 - Itakura , et al. February 24, 2	2009-02-24
Wafer holder for wafer prober and wafer prober equipped with same App 20090045829 - Awazu; Tomoyuki ; et al.	2009-02-19
Body for keeping a wafer and wafer prober using the same Grant 7,425,838 - Itakura , et al. September 16, 2	2008-09-16
Wafer holder, heater unit used for wafer prober and having wafer holder, and wafer prober App 20080211526 - Shinma; Kenji ; et al.	2008-09-04
Wafer holder, and wafer prober provided therewith App 20070205788 - Natsuhara; Masuhiro ; et al.	2007-09-06
Wafer holder, and heater unit and wafer prober provided therewith App 20070205787 - Natsuhara; Masuhiro ; et al.	2007-09-06
Wafer holder, and wafer prober and semiconductor manufacturing apparatus provided therewith App 20070182433 - Natsuhara; Masuhiro ; et al.	2007-08-09
Wafer holder, and heating unit and wafer prober provided with the wafer holder App 20070126457 - Natsuhara; Masuhiro ; et al.	2007-06-07
Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit App 20070082313 - Itakura; Katsuhiro ; et al.	2007-04-12
Heating unit and wafer prober having the same App 20070056952 - Itakura; Katsuhiro ; et al.	2007-03-15
Wafer holder and wafer prober having the same App 20070046305 - Awazu; Tomoyuki ; et al.	2007-03-01
Body for keeping a wafer, heater unit and wafer prober App 20070046307 - Itakura; Katsuhiro ; et al.	2007-03-01
Wafer holder, heater unit having the wafer holder, and wafer prober having the heater unit App 20070046306 - Awazu; Tomoyuki ; et al.	2007-03-01
Wafer holder, heater unit used for wafer prober having the wafer holder, and wafer prober having the heater unit App 20070045778 - Itakura; Katsuhiro ; et al.	2007-03-01
Body for keeping a wafer, method of manufacturing the same and device using the same App 20070029740 - Natsuhara; Masuhiro ; et al.	2007-02-08
Wafer holder for wafer prober and wafer prober equipped with same App 20070028834 - Awazu; Tomoyuki ; et al.	2007-02-08
Wafer holder, heater unit used for wafer prober and having wafer holder, and wafer prober App 20070024304 - Itakura; Katsuhiro ; et al.	2007-02-01
Chuck top, wafer holder having the chuck top, and wafer prober having the chuck top App 20070024313 - Itakura; Katsuhiro ; et al.	2007-02-01
Body for keeping a wafer and wafer prober using the same App 20070024299 - Itakura; Katsuhiro ; et al.	2007-02-01
Wafer holder for wafer prober and wafer prober equipped with the same App 20060186904 - Natsuhara; Masuhiro ; et al.	2006-08-24
Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction App 20060057404 - Itakura; Katsuhiro ; et al.	2006-03-16
Saw device Grant 6,984,918 - Hachigo , et al. January 10, 2	2006-01-10
Solder film manufacturing method, heat sink furnished with solder film, and semiconductor-device-and-heat-sink junction App 20050089700 - Itakura, Katsuhiro ; et al.	2005-04-28
Method for separating chips from diamond wafer Grant 6,805,808 - Fujii , et al. October 19, 2	2004-10-19
Surface acoustic wave element Grant 6,713,941 - Itakura , et al. March 30, 2	2004-03-30
Surface acoustic wave device utilizing a ZnO layer and a diamond layer Grant 6,642,813 - Itakura , et al. November 4, 2	2003-11-04
Method for separating chips from diamond wafer App 20030127428 - Fujii, Satoshi ; et al.	2003-07-10
Surface acoustic wave element App 20030011281 - Itakura, Katsuhiro ; et al.	2003-01-16
Surface Acoustic Wave Device App 20020158549 - Itakura, Katsuhiro ; et al.	2002-10-31
Surface acoustic wave device Grant 6,469,416 - Itakura , et al. October 22, 2	2002-10-22

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