Itagaki; Minehiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Itagaki; Minehiro.The latest application filed is for "photo-semiconductor module and method for manufacturing the same".

Company Profile

0.15.11

Itagaki; Minehiro - Osaka JP
Itagaki; Minehiro - Moriguchi JP
Itagaki, Minehiro - Moriguchi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photo-semiconductor module and method for manufacturing the same Grant 6,890,789 - Ono , et al. May 10, 2	2005-05-10
Photo-semiconductor Module And Method For Manufacturing The Same App 20050042795 - Ono, Masahiro ; et al.	2005-02-24
Photo-semiconductor module and method for manufacturing the same Grant 6,803,639 - Ono , et al. October 12, 2	2004-10-12
Method for producing mounting structure for an electronic component Grant 6,749,889 - Takezawa , et al. June 15, 2	2004-06-15
Method for planarizing circuit board and method for manufacturing semiconductor device Grant 6,723,251 - Itagaki , et al. April 20, 2	2004-04-20
Method for planarizing circuit board and method for manufacturing semiconductor device Grant 6,703,262 - Itagaki , et al. March 9, 2	2004-03-09
Method for producing a printed-circuit board having projection electrodes Grant 6,694,613 - Nakamura , et al. February 24, 2	2004-02-24
Mounting structure for an electronic component and method for producing the same App 20030207073 - Takezawa, Hiroaki ; et al.	2003-11-06
Method for planarizing circuit board and method for manufacturing semiconductor device App 20030092327 - Itagaki, Minehiro ; et al.	2003-05-15
Photo-semiconductor module and method for manufacturing the same App 20020098609 - Ono, Masahiro ; et al.	2002-07-25
Method for fabricating a semiconductor package with a semiconductor device attached to a multilayered substrate Grant 6,372,548 - Bessho , et al. April 16, 2	2002-04-16
Chip carrier and method of manufacturing and mounting the same Grant 6,365,499 - Nakamura , et al. April 2, 2	2002-04-02
Mounting structure for an electronic component and method for producing the same App 20020034620 - Takezawa, Hiroaki ; et al.	2002-03-21
Method For Fabricating A Semiconductor Package With A Semiconductor Device Attached To A Multilayered Substrate App 20020017712 - BESSHO, YOSHIHIRO ; et al.	2002-02-14
Conductive Paste, Its Manufacturing Method, And Printed Wiring Board Using The Same App 20020008228 - TAKEZAWA, HIROAKI ; et al.	2002-01-24
Chip Carrier And Method Of Manufacturing And Mounting The Same App 20020003299 - NAKAMURA, YOSHIFUMI ; et al.	2002-01-10
Printed-circuit board having projection electrodes and method for producing the same App 20010029666 - Nakamura, Yoshifumi ; et al.	2001-10-18
Method For Planarizing Circuit Board And Method For Manufacturing Semiconductor Device App 20010029066 - ITAGAKI, MINEHIRO ; et al.	2001-10-11
Printed-circuit board having projection electrodes and method for producing the same Grant 6,300,576 - Nakamura , et al. October 9, 2	2001-10-09
Semiconductor device and method of manufacturing same App 20010002733 - Bessho, Yoshihiro ; et al.	2001-06-07
Chip carrier Grant 6,229,209 - Nakamura , et al. May 8, 2	2001-05-08
Method for fabricating bump electrodes with a leveling step for uniform heights Grant 6,207,550 - Hase , et al. March 27, 2	2001-03-27
Method of making multi-layered ceramic substrates Grant 5,662,755 - Miura , et al. September 2, 1	1997-09-02
Method of manufacturing a ceramic substrate Grant 5,547,530 - Nakamura , et al. August 20, 1	1996-08-20
Ceramic substrate and manufacturing method thereof Grant 5,525,402 - Nakamura , et al. June 11, 1	1996-06-11
Assembly formed from conductive paste and insulating paste Grant 5,496,619 - Itagaki , et al. March 5, 1	1996-03-05

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