Itabashi; Takeyuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Itabashi; Takeyuki.The latest application filed is for "hydrogen supply device and hydrogen supplying method".

Company Profile

0.28.38

Itabashi; Takeyuki - Hitachi N/A JP
Itabashi; Takeyuki - Yasugi JP
Itabashi; Takeyuki - Aki JP
Itabashi, Takeyuki - Hitachi-shi JP
Itabashi, Takeyuki - Chiyoda-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips Grant 8,368,195 - Tanie , et al. February 5, 2	2013-02-05
Fuel filling and waste solution recovery apparatus and fuel vessel Grant 8,307,863 - Noujima , et al. November 13, 2	2012-11-13
Managing system and method for emissions of environmental pollutants Grant 8,197,752 - Nojima , et al. June 12, 2	2012-06-12
Fuel tank including movable or deformable fuel chamber and waste chamber Grant 8,109,286 - Nojima , et al. February 7, 2	2012-02-07
Semiconductor device Grant 8,053,908 - Tanie , et al. November 8, 2	2011-11-08
Solder ball Grant 8,020,745 - Ota , et al. September 20, 2	2011-09-20
Hydrogen Supply Device and Hydrogen Supplying Method App 20110005473 - Ishikawa; Takao ; et al.	2011-01-13
MRI apparatus with high-resistance magnet Grant 7,847,555 - Komuro , et al. December 7, 2	2010-12-07
Catalyst Having A Dehydrogenation Function Or Hydrogenation Function, Fuel Cell Using The Catalyst And Hydrogen Storage/supply Device App 20100266929 - Kanemoto; Hiroshi ; et al.	2010-10-21
Low loss magnet and magnetic circuit using the same Grant 7,806,991 - Komuro , et al. October 5, 2	2010-10-05
Evaluation system for amount of emission gases through fuel supply chain Grant 7,805,271 - Nojima , et al. September 28, 2	2010-09-28
Semiconductor Device App 20100193936 - TANIE; Hisashi ; et al.	2010-08-05
Semiconductor Device And Method For Manufacturing The Same App 20100171209 - Tanie; Hisashi ; et al.	2010-07-08
Solder Ball App 20100127044 - Ota; Ryo ; et al.	2010-05-27
Hydrogen production system using wind turbine generator Grant 7,667,343 - Oohara , et al. February 23, 2	2010-02-23
Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device Grant 7,579,275 - Nakano , et al. August 25, 2	2009-08-25
Engine system Grant 7,568,452 - Shimada , et al. August 4, 2	2009-08-04
Hydrogen fuel manufacturing method and system with control program for use therein Grant 7,527,660 - Noujima , et al. May 5, 2	2009-05-05
Fuel Filling And Waste Solution Recovery Apparatus And Fuel Vessel App 20090025824 - Noujima; Masafumi ; et al.	2009-01-29
Evaluation System for Amount of Emission Gases Through Fuel Supply Chain App 20080236247 - Nojima; Masafumi ; et al.	2008-10-02
Engine System App 20080202449 - SHIMADA; Atsushi ; et al.	2008-08-28
MRI Apparatus With High-Resistance Magnet App 20080171216 - Komuro; Matahiro ; et al.	2008-07-17
MRI apparatus with high-resistance magnet Grant 7,352,184 - Komuro , et al. April 1, 2	2008-04-01
Fuel Tank App 20080052994 - Nojima; Masafumi ; et al.	2008-03-06
Hydrogen production system using wind turbine generator App 20070216165 - Oohara; Shinya ; et al.	2007-09-20
Engine system App 20070209609 - Shimada; Atsushi ; et al.	2007-09-13
MRI apparatus with high-resistance magnet App 20070159171 - Komuro; Matahiro ; et al.	2007-07-12
Low loss magnet and magnetic circuit using the same App 20070151632 - Komuro; Matahiro ; et al.	2007-07-05
Catalyst material and method of manufacturing the same and fuel cell using the same Grant 7,235,324 - Sugimasa , et al. June 26, 2	2007-06-26
Catalyst material and method of manufacturing the same and fuel cell using the same Grant 7,226,690 - Sugimasa , et al. June 5, 2	2007-06-05
Electroless copper plating solution, electroless copper plating process and production process of circuit board App 20070079727 - Itabashi; Takeyuki ; et al.	2007-04-12
Semiconductor electrode, dye sensitized solar cells and manufacturing method of the same App 20070044835 - Yoshimoto; Naoki ; et al.	2007-03-01
Managing system and method for emissions of environmental pollutants App 20070038388 - Nojima; Masafumi ; et al.	2007-02-15
Electroless copper plating solution, electroless copper plating process and production process of circuit board Grant 7,169,216 - Itabashi , et al. January 30, 2	2007-01-30
Hydrogen supply device and hydrogen supplying method App 20060204799 - Ishikawa; Takao ; et al.	2006-09-14
Electroless plating method, electroless plating device, and production method and production device of semiconductor device App 20060102485 - Nakano; Hiroshi ; et al.	2006-05-18
Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections Grant 6,989,329 - Itabashi , et al. January 24, 2	2006-01-24
Hydrogen fuel manufacturing method and system with control program for use therein App 20050276749 - Noujima, Masafumi ; et al.	2005-12-15
Wiring board and production method thereof, and semiconductor apparatus App 20050271828 - Saito, Toshiro ; et al.	2005-12-08
Catalyst material and method of manufacturing the same and fuel cell using the same App 20050158611 - Sugimasa, Masatoshi ; et al.	2005-07-21
Electroless copper plating machine, and multi-layer printed wiring board Grant 6,900,394 - Itabashi , et al. May 31, 2	2005-05-31
Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same App 20050087447 - Haba, Toshio ; et al.	2005-04-28
Electroless copper plating solution, electroless copper plating process and production process of circuit board App 20050079280 - Itabashi, Takeyuki ; et al.	2005-04-14
Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections App 20050042366 - Itabashi, Takeyuki ; et al.	2005-02-24
Semiconductor production method App 20050029662 - Nakano, Hiroshi ; et al.	2005-02-10
Catalyst material and method of manufacturing the same and fuel cell using the same App 20050031926 - Sugimasa, Masatoshi ; et al.	2005-02-10
Electroless plating method, electroless plating device, and production method and production device of semiconductor device App 20050022745 - Nakano, Hiroshi ; et al.	2005-02-03
Wiring substrate and an electroless copper plating solution for providing interlayer connections Grant 6,831,009 - Itabashi , et al. December 14, 2	2004-12-14
Process and apparatus for manufacturing a semiconductor device Grant 6,815,357 - Homma , et al. November 9, 2	2004-11-09
Electroless copper plating solution, electroless copper plating process and production process of circuit board Grant 6,805,915 - Itabashi , et al. October 19, 2	2004-10-19
Semiconductor device having cobalt alloy film with boron Grant 6,680,540 - Nakano , et al. January 20, 2	2004-01-20
Electroless copper plating solution, the electroless copper plating supplementary solution, and the method of manufacturing wiring board App 20030183120 - Itabashi, Takeyuki ; et al.	2003-10-02
Process and apparatus for manufacturing a semiconductor device App 20030098241 - Homma, Yoshio ; et al.	2003-05-29
Plating method, plating solution, semiconductor device and process for producing the same App 20030085467 - Kobayashi, Kinya ; et al.	2003-05-08
Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device App 20030079683 - Nakano, Hiroshi ; et al.	2003-05-01
Electroless copper plating solution, electroless copper plating process and production process of circuit board App 20030054094 - Itabashi, Takeyuki ; et al.	2003-03-20
Wiring board and production method thereof, and semiconductor apparatus App 20020148733 - Saito, Toshiro ; et al.	2002-10-17
Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same App 20020084191 - Haba, Toshio ; et al.	2002-07-04
Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor App 20020064947 - Itabashi, Takeyuki ; et al.	2002-05-30
Circuit board, a method for manufacturing same, and a method of electroless plating Grant 6,370,768 - Itabashi April 16, 2	2002-04-16
Semiconductor device having wires and insulator layers with via-studs App 20020030283 - Itabashi, Takeyuki ; et al.	2002-03-14
Semiconducting system and production method App 20010030366 - Nakano, Hiroshi ; et al.	2001-10-18
Semiconductor device and method of manufacturing the same Grant 6,300,244 - Itabashi , et al. October 9, 2	2001-10-09
Method for formation of conductor using electroless plating Grant 5,595,943 - Itabashi , et al. January 21, 1	1997-01-21
Process for the formation of a conductive circuit pattern Grant 5,294,291 - Akahoshi , et al. March 15, 1	1994-03-15

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