Israel; Emil Casey
Patent Applications and Registrations
Patent applications and USPTO patent grants for Israel; Emil Casey.The latest application filed is for "heatsink very-thin quad flat no-leads (hvqfn) package".
- Israel; Emil Casey - Brueggen DE
- Israel; Emil Casey - Nijmegen NL
| Patent | Date |
|---|---|
| Heatsink very-thin quad flat no-leads (HVQFN) package Grant 9,953,903 - van Gemert , et al. April 24, 2 | 2018-04-24 |
| Heatsink Very-thin Quad Flat No-leads (hvqfn) Package App 20170025334 - van Gemert; Leonardus Antonius Elisabeth ; et al. | 2017-01-26 |
| Exposed die clip bond power package Grant 9,263,299 - van Gemert , et al. February 16, 2 | 2016-02-16 |
| Exposed Die Quad Flat No-leads (qfn) Package App 20160005679 - Israel; Emil Casey ; et al. | 2016-01-07 |
| Exposed Die Clip Bond Power Package App 20160005626 - van Gemert; Leonardus Antonius Elisabeth ; et al. | 2016-01-07 |
| Exposed-Heatsink Quad Flat No-Leads (QFN) Package App 20160005680 - Israel; Emil Casey ; et al. | 2016-01-07 |
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