Isono; Toshihisa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Isono; Toshihisa.The latest application filed is for "plating method".
- Isono; Toshihisa - Osaka N/A JP
- Isono; Toshihisa - Hirakata N/A JP
- Isono; Toshihisa - Hirakata-shi JP
| Patent | Date |
|---|---|
| Plating method Grant 9,730,337 - Isono , et al. August 8, 2 | 2017-08-08 |
| Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bath Grant 9,028,668 - Isono , et al. May 12, 2 | 2015-05-12 |
| Continuous copper electroplating method Grant 8,801,912 - Omura , et al. August 12, 2 | 2014-08-12 |
| Plating Method App 20140120245 - Isono; Toshihisa ; et al. | 2014-05-01 |
| Copper electroplating bath Grant 8,679,317 - Isono , et al. March 25, 2 | 2014-03-25 |
| Manufacture Method Of Buildup Circuit Board App 20130056362 - TACHIBANA; Shinji ; et al. | 2013-03-07 |
| Continuous copper electroplating method Grant 7,988,842 - Tachibana , et al. August 2, 2 | 2011-08-02 |
| Copper Electrolytic Plating Bath And Copper Electrolytic Plating Method App 20110089044 - Isono; Toshihisa ; et al. | 2011-04-21 |
| Electrolytic Copper Plating Bath And Method For Electroplating Using The Electrolytic Copper Plating Bath App 20110062029 - Isono; Toshihisa ; et al. | 2011-03-17 |
| Electrolytic Plating Equipment And Electrolytic Plating Method App 20110056840 - Isono; Toshihisa ; et al. | 2011-03-10 |
| Electrolytic copper plating process Grant 7,892,411 - Tachibana , et al. February 22, 2 | 2011-02-22 |
| Copper Electroplating Bath App 20100219081 - Isono; Toshihisa ; et al. | 2010-09-02 |
| Continuous Copper Electroplating Method App 20090229986 - OMURA; Naoyuki ; et al. | 2009-09-17 |
| Manufacture Method Of Buildup Circuit Board App 20090092749 - TACHIBANA; Shinji ; et al. | 2009-04-09 |
| Electrolytic Copper Plating Process App 20090038952 - TACHIBANA; Shinji ; et al. | 2009-02-12 |
| Continuous Copper Electroplating Method App 20090026083 - TACHIBANA; Shinji ; et al. | 2009-01-29 |
| Electrolytic copper plating bath and plating process therewith Grant 7,220,347 - Isono , et al. May 22, 2 | 2007-05-22 |
| Electrolytic copper plating bath and plating process therewith App 20060207886 - Isono; Toshihisa ; et al. | 2006-09-21 |
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