loadpatents
Patent applications and USPTO patent grants for Ismail; Sarel Bin.The latest application filed is for "integrated circuit package fabrication".
Patent | Date |
---|---|
Integrated circuit package fabrication Grant 9,859,197 - Eugene Lee , et al. January 2, 2 | 2018-01-02 |
Lead frame with abutment surface Grant 9,184,119 - Eugene Lee , et al. November 10, 2 | 2015-11-10 |
Integrated Circuit Package Fabrication App 20150228581 - Eugene Lee; Lee Han Meng@ ;   et al. | 2015-08-13 |
Lead Frame With Abutment Surface App 20150228563 - Eugene Lee; Lee Han Meng@ ;   et al. | 2015-08-13 |
Integrated circuit package and method of making Grant 9,013,028 - Lee , et al. April 21, 2 | 2015-04-21 |
Integrated Circuit Package And Method Of Making App 20140191380 - Lee; Lee Han Meng@Eugene ;   et al. | 2014-07-10 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.