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Patent applications and USPTO patent grants for Ismail; Ismadi Bin.The latest application filed is for "stacking arrays and separator bodies during processing of component carriers on array level".
Patent | Date |
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Stacking Arrays and Separator Bodies During Processing of Component Carriers on Array Level App 20210195753 - Nickkolgh; Amin ;   et al. | 2021-06-24 |
Component Carrier With Electrically Reliable Bridge With Sufficiently Thick Vertical Thickness in Through Hole of Thin Dielectric App 20210161012 - Ismail; Ismadi Bin ;   et al. | 2021-05-27 |
Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric Grant 10,966,318 - Ismail , et al. March 30, 2 | 2021-03-30 |
Component Carrier With Electrically Reliable Bridge With Sufficiently Thick Vertical Thickness in Through Hole of Thin Dielectri App 20200253053 - Kind Code | 2020-08-06 |
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