Islam; Shafidul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Islam; Shafidul.The latest application filed is for "lead frame routed chip pads for semiconductor packages".

Company Profile

0.15.15

Islam; Shafidul - Plano TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Lead frame routed chip pads for semiconductor packages Grant 8,304,864 - San Antonio , et al. November 6, 2	2012-11-06
Reversible leadless package and methods of making and using same Grant 8,058,104 - Islam , et al. November 15, 2	2011-11-15
Package having exposed integrated circuit device Grant 8,053,869 - McKerreghan , et al. November 8, 2	2011-11-08
Lead Frame Routed Chip Pads For Semiconductor Packages App 20110001224 - San Antonio; Romarico Santos ; et al.	2011-01-06
Lead frame routed chip pads for semiconductor packages Grant 7,820,480 - Islam , et al. October 26, 2	2010-10-26
Lead frame routed chip pads for semiconductor packages Grant 7,795,710 - Islam , et al. September 14, 2	2010-09-14
Reversible Leadless Package And Methods Of Making And Using Same App 20100221872 - Islam; Shafidul ; et al.	2010-09-02
Reversible leadless package and methods of making and using same Grant 7,709,935 - Islam , et al. May 4, 2	2010-05-04
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,622,332 - Islam , et al. November 24, 2	2009-11-24
Package Having Exposed Integrated Circuit Device App 20090215244 - McKerreghan; Michael H. ; et al.	2009-08-27
Semiconductor device package and method for manufacturing same Grant 7,563,648 - Islam , et al. July 21, 2	2009-07-21
Package having exposed integrated circuit device Grant 7,554,180 - McKerreghan , et al. June 30, 2	2009-06-30
Taped lead frames and methods of making and using the same in semiconductor packaging Grant 7,439,097 - Islam , et al. October 21, 2	2008-10-21
Lead frame routed chip pads for semiconductor packages App 20080076206 - Islam; Shafidul ; et al.	2008-03-27
Die pad for semiconductor packages and methods of making and using same Grant 7,262,491 - Islam , et al. August 28, 2	2007-08-28
Semiconductor device package and method for manufacturing same App 20070161157 - Islam; Shafidul ; et al.	2007-07-12
Package having exposed integrated circuit device App 20070145547 - McKerreghan; Michael H. ; et al.	2007-06-28
Reversible leadless package and methods of making and using same App 20070111374 - Islam; Shafidul ; et al.	2007-05-17
Die pad for semiconductor packages and methods of making and using same App 20070052070 - Islam; Shafidul ; et al.	2007-03-08
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 7,129,116 - Islam , et al. October 31, 2	2006-10-31
Lead frame routed chip pads for semiconductor packages App 20060151860 - Islam; Shafidul ; et al.	2006-07-13
Taped lead frames and methods of making and using the same in semiconductor packaging App 20060001130 - Islam; Shafidul ; et al.	2006-01-05
Partially patterned lead frames and methods of making and using the same in semiconductor packaging App 20050263864 - Islam, Shafidul ; et al.	2005-12-01
Partially patterned lead frames and methods of making and using the same in semiconductor packaging App 20050006737 - Islam, Shafidul ; et al.	2005-01-13
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 6,812,552 - Islam , et al. November 2, 2	2004-11-02
Partially patterned lead frames and methods of making and using the same in semiconductor packaging Grant 6,777,265 - Islam , et al. August 17, 2	2004-08-17
Taped lead frames and methods of making and using the same in semiconductor packaging App 20040058478 - Islam, Shafidul ; et al.	2004-03-25
Partially patterned lead frames and methods of making and using the same in semiconductor packaging App 20030207498 - Islam, Shafidul ; et al.	2003-11-06
Partially patterned lead frames and methods of making and using the same in semiconductor packaging App 20030203539 - Islam, Shafidul ; et al.	2003-10-30
New IC molding process Grant 4,812,114 - Kennon , et al. March 14, 1	1989-03-14

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