Islam; Mohammed Rabiul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Islam; Mohammed Rabiul.The latest application filed is for "three-dimensional integrated circuit (3d ic) low-dropout (ldo) regulator power delivery".

Company Profile

2.5.9

Islam; Mohammed Rabiul - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Three-dimensional Integrated Circuit (3D IC) Low-dropout (LDO) Regulator Power Delivery App 20220302089 - Rusu; Stefan ; et al.	2022-09-22
Heterogeneous Packaging Integration Of Photonic And Electronic Elements App 20220283387 - RUSU; Stefan ; et al.	2022-09-08
Photonic Semiconductor Device And Method App 20220128759 - Islam; Mohammed Rabiul ; et al.	2022-04-28
Structures And Methods For High Speed Interconnection In Photonic Systems App 20220066099 - SONG; Weiwei ; et al.	2022-03-03
Photonic semiconductor device and method Grant 11,215,753 - Islam , et al. January 4, 2	2022-01-04
Photonic Semiconductor Device And Method App 20210271020 - Islam; Mohammed Rabiul ; et al.	2021-09-02
Method And System For Latch-up Prevention App 20210117605 - Lai; Po-Chia ; et al.	2021-04-22
Method for forming a dual inlaid copper interconnect structure Grant 6,551,919 - Venkatesan , et al. April 22, 2	2003-04-22
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process App 20020151167 - Farkas, Janos ; et al.	2002-10-17
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process Grant 6,444,569 - Farkas , et al. September 3, 2	2002-09-03
Method for forming a dual inlaid copper interconnect structure App 20020039836 - Venkatesan, Suresh ; et al.	2002-04-04
Method for forming a dual inlaid copper interconnect structure Grant 6,326,301 - Venkatesan , et al. December 4, 2	2001-12-04
Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process App 20010027083 - Farkas, Janos ; et al.	2001-10-04
Method for forming a copper layer over a semiconductor wafer Grant 6,297,155 - Simpson , et al. October 2, 2	2001-10-02

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