Ishizuka; Toru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ishizuka; Toru.The latest application filed is for "method for manufacturing bonded soi wafer".
- Ishizuka; Toru - Takasaki JP
- ISHIZUKA; Toru - Takasaki-shi JP
- Ishizuka; Toru - Annaka N/A JP
- Ishizuka; Toru - Tokyo JP
- Ishizuka; Toru - Gunma JP
- Ishizuka; Toru - Higashikurume JP
| Patent | Date |
|---|---|
| Method for manufacturing bonded SOI wafer Grant 11,244,852 - Ishizuka , et al. February 8, 2 | 2022-02-08 |
| Method for producing bonded SOI wafer Grant 11,056,381 - Ishizuka , et al. July 6, 2 | 2021-07-06 |
| Method For Manufacturing Bonded Soi Wafer App 20200152505 - ISHIZUKA; Toru ; et al. | 2020-05-14 |
| Method for manufacturing bonded SOI wafer Grant 10,600,677 - Ishizuka , et al. | 2020-03-24 |
| Method for manufacturing a bonded SOI wafer Grant 10,424,484 - Ishizuka , et al. Sept | 2019-09-24 |
| Method For Manufacturing Bonded Soi Wafer App 20190198386 - ISHIZUKA; Toru ; et al. | 2019-06-27 |
| Bonded Wafer Production Method And Bonded Wafer App 20180277422 - ISHIZUKA; Toru ; et al. | 2018-09-27 |
| Method For Producing Bonded Soi Wafer App 20180247860 - ISHIZUKA; Toru ; et al. | 2018-08-30 |
| Method for manufacturing bonded wafer Grant 9,842,763 - Ishizuka , et al. December 12, 2 | 2017-12-12 |
| Method For Manufacturing A Bonded Soi Wafer App 20170345663 - ISHIZUKA; Toru ; et al. | 2017-11-30 |
| Method For Manufacturing Bonded Wafer App 20170301582 - ISHIZUKA; Toru ; et al. | 2017-10-19 |
| Method of fabricating SOI wafer by ion implantation Grant 9,735,045 - Ishizuka , et al. August 15, 2 | 2017-08-15 |
| Method for manufacturing SOI wafer Grant 9,673,085 - Aga , et al. June 6, 2 | 2017-06-06 |
| Reclaiming processing method for delaminated wafer Grant 9,496,130 - Ishizuka , et al. November 15, 2 | 2016-11-15 |
| Method for manufacturing SOI wafer Grant 9,378,999 - Aga , et al. June 28, 2 | 2016-06-28 |
| Method for manufacturing SOI wafer Grant 9,337,080 - Aga , et al. May 10, 2 | 2016-05-10 |
| Method Of Manufacturing Bonded Wafer App 20160079114 - ISHIZUKA; Toru ; et al. | 2016-03-17 |
| Method For Manufacturing Soi Wafer App 20150249035 - Aga; Hiroji ; et al. | 2015-09-03 |
| Method For Manufacturing Soi Wafer App 20150243550 - Aga; Hiroji ; et al. | 2015-08-27 |
| Method for manufacturing bonded SOI wafer Grant 9,093,497 - Kobayashi , et al. July 28, 2 | 2015-07-28 |
| Method For Manufacturing Soi Wafer App 20150206790 - Aga; Hiroji ; et al. | 2015-07-23 |
| Method for manufacturing a bonded SOI wafer Grant 9,076,840 - Kobayashi , et al. July 7, 2 | 2015-07-07 |
| Method for manufacturing SOI wafer Grant 9,029,240 - Aga , et al. May 12, 2 | 2015-05-12 |
| Method For Manufacturing Soi Wafer App 20150064875 - Aga; Hiroji ; et al. | 2015-03-05 |
| Method For Manufacturing Bonded Soi Wafer App 20150017783 - Kobayashi; Norihiro ; et al. | 2015-01-15 |
| Method For Manufacturing A Bonded Soi Wafer App 20140322895 - Kobayashi; Norihiro ; et al. | 2014-10-30 |
| Reclaiming Processing Method For Delaminated Wafer App 20140273400 - Ishizuka; Toru ; et al. | 2014-09-18 |
| Occludator, face bow, occlusion-confirming system and temporomandibular joint-reproducing system Grant 7,534,105 - Arai , et al. May 19, 2 | 2009-05-19 |
| Method for producing direct bonded wafer and direct bonded wafer Grant 7,521,334 - Kobayashi , et al. April 21, 2 | 2009-04-21 |
| Plant growing analyzing system and method Grant 7,499,573 - Tanabata , et al. March 3, 2 | 2009-03-03 |
| Method for Producing Direct Bonded Wafer and Direct Bonded Wafer App 20080102603 - Kobayashi; Norihiro ; et al. | 2008-05-01 |
| Occludator, face bow, occlusion-confirming system and temporomandibular joint-reproducing system App 20050277086 - Arai, Yoshinori ; et al. | 2005-12-15 |
| Plant growing analyzing system and method App 20050180608 - Tanabata, Takanari ; et al. | 2005-08-18 |
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