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name:-0.0061841011047363
name:-0.0063478946685791
name:-0.00095677375793457
Ishizuka; Tohru Patent Filings

Ishizuka; Tohru

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishizuka; Tohru.The latest application filed is for "method for manufacturing bonded wafer".

Company Profile
1.14.10
  • Ishizuka; Tohru - Takasaki JP
  • Ishizuka; Tohru - Annaka N/A JP
  • Ishizuka; Tohru - Gunma JP
  • Ishizuka; Tohru - Kitamoto JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for manufacturing bonded wafer
Grant 9,142,449 - Ishizuka September 22, 2
2015-09-22
Method For Manufacturing Bonded Wafer
App 20150118825 - Ishizuka; Tohru
2015-04-30
Silicon epitaxial wafer, method for manufacturing the same, bonded SOI wafer and method for manufacturing the same
Grant 8,823,130 - Kato , et al. September 2, 2
2014-09-02
Method for manufacturing bonded wafer
Grant 8,697,544 - Ishizuka , et al. April 15, 2
2014-04-15
SOI wafer, semiconductor device, and method for manufacturing SOI wafer
Grant 8,466,538 - Ishizuka , et al. June 18, 2
2013-06-18
Silicon Epitaxial Wafer, Method For Manufacturing The Same, Bonded Soi Wafer And Method For Manufacturing The Same
App 20120326268 - Kato; Masahiro ;   et al.
2012-12-27
Method for manufacturing SOI substrate
Grant 8,338,277 - Takeno , et al. December 25, 2
2012-12-25
Method for manufacturing SOI wafer
Grant 8,202,787 - Ishizuka , et al. June 19, 2
2012-06-19
Method for manufacturing bonded wafer
Grant 8,097,523 - Kobayashi , et al. January 17, 2
2012-01-17
Method For Manufacturing Soi Wafer
App 20110223740 - Ishizuka; Tohru ;   et al.
2011-09-15
Method For Manufacturing Bonded Wafer
App 20110212598 - Ishizuka; Tohru ;   et al.
2011-09-01
Method For Manufacturing Bonded Wafer
App 20110151643 - Kobayashi; Norihiro ;   et al.
2011-06-23
Method For Manufacturing Bonded Wafer
App 20110104870 - Kobayashi; Norihiro ;   et al.
2011-05-05
Method for measuring rotation angle of bonded wafer
Grant 7,861,421 - Kobayashi , et al. January 4, 2
2011-01-04
Method For Manufacturing Soi Substrate
App 20100323502 - Takeno; Hiroshi ;   et al.
2010-12-23
Soi Wafer, Semiconductor Device, And Method For Manufacturing Soi Wafer
App 20100314722 - Ishizuka; Tohru ;   et al.
2010-12-16
Method for manufacturing SOI substrate
Grant 7,799,660 - Ishizuka , et al. September 21, 2
2010-09-21
Method For Measuring Rotation Angle Of Bonded Wafer
App 20100132205 - Kobayashi; Norihiro ;   et al.
2010-06-03
Method for manufacturing SOI substrate
App 20080261411 - Ishizuka; Tohru ;   et al.
2008-10-23
Benzocycloheptene derivative and process for preparation thereof
Grant 5,252,589 - Ozeki , et al. October 12, 1
1993-10-12
Benzo-furan derivative
Grant 4,829,067 - Iijima , et al. May 9, 1
1989-05-09

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