loadpatents
Patent applications and USPTO patent grants for ISHIZAKI; Takahiro.The latest application filed is for "method of manufacturing composite member and the composite member".
Patent | Date |
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Method Of Manufacturing Composite Member And The Composite Member App 20210299923 - YAMAGUCHI; Eiji ;   et al. | 2021-09-30 |
Dispersion strengthened austenitic stainless steel article, method for manufacturing same and product made of same Grant 11,053,562 - Ishizaki , et al. July 6, 2 | 2021-07-06 |
Austenitic Stainless Steel and Reactor Internal Structure App 20210189537 - ISHIZAKI; Takahiro ;   et al. | 2021-06-24 |
Building Grant 10,840,524 - Tateishi , et al. November 17, 2 | 2020-11-17 |
Building App 20200083548 - TATEISHI; Takaharu ;   et al. | 2020-03-12 |
Dispersion Strengthened Austenitic Stainless Steel Article, Method For Manufacturing Same And Product Made Of Same App 20180274053 - ISHIZAKI; Takahiro ;   et al. | 2018-09-27 |
Austenitic Stainless Steel And Method For Producing The Same App 20170167005 - ISHIZAKI; Takahiro ;   et al. | 2017-06-15 |
Surface treating apparatus Grant 9,359,676 - Hotta , et al. June 7, 2 | 2016-06-07 |
Surface treating apparatus Grant 9,120,113 - Hotta , et al. September 1, 2 | 2015-09-01 |
Electrolytic regeneration device Grant 9,045,836 - Saijo , et al. June 2, 2 | 2015-06-02 |
Surface Treating Apparatus App 20140116334 - HOTTA; Teruyuki ;   et al. | 2014-05-01 |
Surface Treating Apparatus App 20140053774 - HOTTA; Teruyuki ;   et al. | 2014-02-27 |
Electroless Copper Plating Bath And Electroless Copper Plating Method App 20130295294 - ISHIZAKI; Takahiro ;   et al. | 2013-11-07 |
Method for manufacturing printed circuit board Grant 8,276,270 - Hotta , et al. October 2, 2 | 2012-10-02 |
Method for forming a circuit pattern Grant 8,262,831 - Hashimoto , et al. September 11, 2 | 2012-09-11 |
Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board Grant 8,197,583 - Hotta , et al. June 12, 2 | 2012-06-12 |
Electroless plating solution, method for electroless plating using the same and method for manufacturing circuit board Grant 8,137,447 - Hotta , et al. March 20, 2 | 2012-03-20 |
Electroless Plating Solution, Method For Electroless Plating Using The Same And Method For Manufacturing Circuit Board App 20120058254 - Hotta; Teruyuki ;   et al. | 2012-03-08 |
Electrolytic Regeneration Device App 20120048728 - SAIJO; Yoshikazu ;   et al. | 2012-03-01 |
Method And Agent For Surface Processing Of Printed Circuit Board Substrate App 20110259373 - Hotta; Teruyuki ;   et al. | 2011-10-27 |
Method For Forming A Circuit Pattern App 20100243149 - Hashimoto; Shigeo ;   et al. | 2010-09-30 |
Electrochromic mirror Grant 7,800,807 - Nakaho , et al. September 21, 2 | 2010-09-21 |
Method For Manufacturing Printed Circuit Board App 20100181104 - Hotta; Teruyuki ;   et al. | 2010-07-22 |
Electrochromic mirror Grant 7,692,843 - Nakaho , et al. April 6, 2 | 2010-04-06 |
Electroless Plating Solution, Method For Electroless Plating Using The Same And Method For Manufacturing Circuit Board App 20100003399 - HOTTA; TERUYUKI ;   et al. | 2010-01-07 |
Electrochromic mirror Grant 7,643,201 - Nakaho , et al. January 5, 2 | 2010-01-05 |
Electrochromic Mirror App 20090002800 - NAKAHO; Junichi ;   et al. | 2009-01-01 |
Electrochromic Mirror App 20090002801 - NAKAHO; Junichi ;   et al. | 2009-01-01 |
Electrochromic Mirror App 20090002799 - NAKAHO; Junichi ;   et al. | 2009-01-01 |
Method of paper machine control and apparatus for the method Grant 6,904,331 - Sasaki , et al. June 7, 2 | 2005-06-07 |
Method of paper machine control and apparatus for the method App 20020198621 - Sasaki, Takashi ;   et al. | 2002-12-26 |
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