Ishizaka; Yasushi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Ishizaka; Yasushi.The latest application filed is for "adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same".

Company Profile

1.8.8

Ishizaka; Yasushi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesive composition, and method of bonding an adherend and method of producing a stack, each of which uses the same Grant 10,988,646 - Mieda , et al. April 27, 2	2021-04-27
Curable and hygroscopic resin composition for sealing electronic devices, resin cured material, and electronic device Grant 10,829,669 - Mieda , et al. November 10, 2	2020-11-10
Curable and hygroscopic resin composition for sealing electronic devices, sealing resin, and electronic device Grant 10,556,974 - Mieda , et al. Feb	2020-02-11
Resin composition for sealing electronic device, and electronic device Grant 10,196,534 - Asanuma , et al. Fe	2019-02-05
Resin composition for sealing electronic device, and electronic device Grant 10,196,547 - Aoyama , et al. Fe	2019-02-05
Adhesive Composition, And Method Of Bonding An Adherend And Method Of Producing A Stack, Each Of Which Uses The Same App 20180291242 - MIEDA; Tetsuya ; et al.	2018-10-11
Filler material for organic electroluminescent element and method of sealing organic electroluminiscent element Grant 10,084,153 - Mihara , et al. September 25, 2	2018-09-25
Resin composition for sealing electronic devices, and electronic device Grant 10,079,360 - Mieda , et al. September 18, 2	2018-09-18
Curable And Hygroscopic Resin Composition For Sealing Electronic Devices, Resin Cured Material, And Electronic Device App 20180208804 - MIEDA; Tetsuya ; et al.	2018-07-26
Resin Composition For Sealing Electronic Devices, And Electronic Device App 20170331070 - MIEDA; Tetsuya ; et al.	2017-11-16
Curable And Hygroscopic Resin Composition For Sealing Electronic Devices, Sealing Resin, And Electronic Device App 20170327608 - MIEDA; Tetsuya ; et al.	2017-11-16
Filler material for organic electroluminescent element and method of sealing organic electroluminescent element Grant 9,793,511 - Mihara , et al. October 17, 2	2017-10-17
Resin Composition For Sealing Electronic Device, And Electronic Device App 20160362587 - AOYAMA; Masami ; et al.	2016-12-15
Resin Composition For Sealing Electronic Device, And Electronic Device App 20160362576 - ASANUMA; Takumi ; et al.	2016-12-15
Filler Material For Organic Electroluminescent Element And Method Of Sealing Organic Electroluminescent Element App 20160308164 - MIHARA; Naoaki ; et al.	2016-10-20
Filler Material For Organic Electroluminescent Element And Method Of Sealing Organic Electroluminiscent Element App 20160308165 - MIHARA; Naoaki ; et al.	2016-10-20

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